Hardware / Board Design Engineer - Power, Control & Sensors

Mentee Robotics, now part of Mobileye, brings world-class robotics expertise, together with Mobileye's decades of leadership in computer vision, machine learning, and autonomous driving technologies. Building on that foundation, Mentee by Mobileye is creating the "MenteeBot", the AI-first humanoid robot that combines perception, reasoning, learning, and advanced dexterous manipulation, designed to work alongside people in their everyday lives, at the workplace and in the home.

At Mobileye, our technologies power more than 230 million vehicles worldwide and have helped shape the future of autonomous mobility. With teams around the world, we continue to innovate at the forefront of autonomous systems, advancing the next generation of Physical AI for real life.

Your Role

We’re looking for a mid-level or senior hardware engineer to own custom electronics across our humanoid platform, with a strong emphasis on motor-drive and power electronics alongside embedded control, sensor interfaces, and communication boards.

You’ll take projects from requirements and architecture through circuit design, PCB implementation, bring-up, validation, and production transfer.

PCB layout is currently supported by external partners. You’ll define the constraints, guide implementation, review the results, and remain accountable for the complete board design. We welcome engineers who use AI-assisted design and verification tools effectively while applying sound electrical judgment and measurement-based validation.

Responsibilities

• Own board requirements, architecture, circuit design, component selection, and schematic capture across multiple projects.
• Design motor-drive electronics, gate-driver circuits, current sensing, protection, DC-DC conversion, and power distribution.
• Develop MCU-based control boards, sensor interfaces, and mixed-signal circuits.
• Design communication interfaces such as EtherCAT, Ethernet, CAN/FDCAN, RS-485, SPI, I²C, UART, and USB as required.
• Define PCB stack-ups, placement and routing constraints, grounding, thermal requirements, and signal- and power-integrity considerations.
• Guide external PCB layout partners and review placement, routing, manufacturing outputs, and DFM/DFT feedback.
• Plan and execute board bring-up, characterization, fault investigation, and validation against requirements.
• Collaborate with embedded software, motion control, mechanical, and test engineers on subsystem integration.
• Own bills of materials, design documentation, release packages, engineering changes, and technical support for prototype and production builds.

Requirements

• 4+ years of relevant hardware-development experience, including independent ownership of boards through bring-up and validation.
• B.Sc. in Electrical/Electronics Engineering or equivalent proven practical experience.
• Strong foundations in analog, digital, mixed-signal, and power circuit design.
• Proven experience with motor-drive or power-electronics circuits, including switching stages, gate drivers, sensing, and protection.
• Experience with microcontroller-based systems, sensor interfaces, and digital communication circuits.
• Ability to define and review multilayer PCB implementation, including high-current paths, grounding, thermal management, controlled impedance where needed, and EMI/EMC considerations.
• Proficiency with schematic and PCB design tools; Altium Designer preferred but any CAD is sufficient.
• Strong hands-on debugging skills using oscilloscopes, differential and current probes, multimeters, and other relevant lab equipment.
• Ability to coordinate external design partners, manage concurrent projects, and maintain clear engineering documentation.

Advantages

• Experience with compact BLDC/PMSM motor controllers and actuator electronics.
• Precision current sensing, encoder interfaces, and low-noise analog design.
• EtherCAT, Ethernet, and CAN/FDCAN hardware integration.
• Advanced high-speed digital design, HDI, flex, or rigid-flex boards.
• Circuit simulation, thermal analysis, and signal- or power-integrity analysis.
• Experience with manufacturing test, EMC validation, component lifecycle management, and production transfer.
• Effective use of AI tools for design review, analysis, verification, and engineering automation.