Senior Power Integrity Engineer

Description

Board Design Engineer

Location: Raanana

About Us

DriveNets is a leader in disaggregated high-scale solutions for service providers and AI infrastructures. Founded in December 2015, DriveNets created a radical new way to build networks by adapting the architectural model of the cloud to telco-grade . This solution accelerates deployment, improves the ’s economic model, and radically simplifies operations. With customers including Comcast, Orange, and KDDI - over 80% of AT&T’s traffic now runs through a disaggregated core powered by DriveNets software. DriveNets Cloud-AI solution, based on the same technology, was introduced to the market in 2023, providing the highest-performance Ethernet-based AI solution, and is already deployed by Hyperscalers, NeoClouds and Enterprises. Raising over $587 million in three funding rounds, DriveNets continues to deploy the most innovative infrastructure and is looking for the most talented people to be part of this journey.

The Role

DriveNets is seeking a highly motivated Power Integrity Engineer to join our Hardware Engineering team. In this role, you will be responsible for defining, analyzing, simulating, and validating power delivery networks (PDNs) for next-generation networking platforms supporting high-performance ASICs, advanced SerDes interfaces, optical modules, and AI-scale networking systems.

You will work closely with hardware architects, PCB designers, ASIC teams, signal integrity engineers, mechanical engineers, and manufacturing partners to ensure robust power delivery, optimal system performance, and successful product deployment.

Responsibilities

• Lead Power Integrity (PI) activities throughout the hardware development lifecycle, from architecture through production.
• Define and optimize board-level and package-level Power Delivery Networks (PDNs) for high-current networking ASICs and supporting devices.
• Perform pre-layout and post-layout PI simulations using industry-standard tools.
• Establish target impedance requirements and validate compliance across all power rails.
• Analyze DC voltage drop, AC impedance, transient response, and power distribution performance.
• Collaborate with PCB layout engineers to optimize stackups, plane structures, decoupling strategies, and power routing.
• Work closely with Signal Integrity engineers to ensure SI/PI co-optimization of high-speed interfaces.
• Develop power integrity design guidelines and best practices for next-generation networking products.
• Support schematic reviews, layout reviews, and design sign-off activities.
• Perform laboratory measurements and correlation using oscilloscopes, VNAs, power analyzers, current probes, and related equipment.
• Investigate and resolve PI-related issues during board bring-up, validation, and production.
• Collaborate with ASIC, FPGA, memory, optics, and power component vendors to optimize overall system performance.
• Drive continuous improvement of PI methodologies, simulation flows, and validation processes.
  
  

• Work on industry-leading networking systems deployed by top-tier service providers and cloud operators.
• Influence next-generation networking hardware architecture.
• Collaborate with world-class hardware, ASIC, and software engineers.
• Be part of a fast-growing company transforming the networking industry
  
  

• B.Sc. or M.Sc. in Electrical Engineering.
• 5+ years of experience in Power Integrity, Hardware Design, or related disciplines.
• Strong understanding of power delivery networks, decoupling methodologies, and target impedance concepts.
• Hands-on experience with PI simulation tools such as:
• Cadence Sigrity PowerSI / OptimizePI
• Ansys SIwave
• Ansys HFSS
• PowerDC or equivalent
• Experience designing high-layer-count PCBs for networking, telecom, server, or data-center products.
• Knowledge of high-speed digital systems and interaction between Signal Integrity and Power Integrity.
• Experience with multi-phase voltage regulators, power sequencing, and power management architectures.
• Strong understanding of PCB materials, stackups, and manufacturing constraints.
• Experience performing lab validation and correlation measurements.
• Excellent problem-solving, communication, and teamwork skills.
  
  

• Experience with high-performance networking ASICs and switch silicon.
• Familiarity with 112G/224G/448G PAM4 SerDes technologies.
• Experience with Ethernet systems ranging from 400G to 1.6T and above.
• Understanding of package-level PI and advanced packaging technologies.
• Familiarity with optical networking platforms and co-packaged optics.
• Experience with thermal and mechanical effects on PDN performance.
• Knowledge of EMI/EMC considerations in high-density networking systems.
• Experience working with ODMs, CMs, and global manufacturing partners.
  
  

• Achieve PI sign-off requirements for all networking platforms.
• Minimize power-related issues during bring-up and production.
• Improve first-pass hardware success rate.
• Enable reliable operation of next-generation high-bandwidth networking systems.
• Establish scalable PI methodologies for future DriveNets hardware platforms.