Senior Power Engineer

Our team in Yokneam, Israel is looking for a Senior Power Integrity Engineer to join the Hardware Board Design team and lead PI development of next-generation Network Adapters for high-speed communication products. NVIDIA’s Networking division delivers end-to-end InfiniBand and Ethernet connectivity for servers and storage, including adapter cards, switches, cables and software that power data centers, cloud, big data, Web 2.0 and high-performance computing workloads.

What You'll Be Doing

• Lead PI definition and implementation for board-level designs, from concept and architecture through validation, qualification and release to production.
• Define the power core architecture and requirements and serve as the technical lead for all power-related performance and debug activities
• Work closely with power supply vendors to align solutions with NVIDIA product needs, and build and optimize configuration files for programmable regulators.
• Own power delivery network (PDN) design for complex network adapter boards, including rail partitioning, decoupling strategy, VR selection and dynamic load support.
• Perform system-level power integrity simulations (frequency and time domain) and co-simulation of circuits and PDN models to predict noise.
• Create and maintain board PI design guidelines: stackup, materials, breakout, routing, decoupling and placement rules for layout teams and external partners.
• Use advanced 2D/3D EM tools to model and optimize vias, planes, connectors, sockets and other interconnect elements for power integrity.
• Perform lab characterization and correlation using VNA, TDR and high‑bandwidth oscilloscopes; refine models and design rules based on measurement data.
  
  

• B.Sc. in Electrical Engineering (or equivalent experience).
• 5+ years of industry experience in signal and/or power integrity for high-speed board or system designs.
• Strong understanding of electromagnetics, transmission line theory, PDN behavior and their application.
• Expert-level proficiency with EM and PI tools (for example, Ansys HFSS/Q3D/SIwave, CST, or equivalent) and SPICE-based time-domain simulations.
• Proven experience in PDN analysis, including model generation, impedance targets, resonance mitigation and time-domain noise simulations.
• Hands-on lab experience with VNA, TDR and oscilloscopes for PI/SI validation, de-embedding and model correlation.
• Ability to work independently in an intense, multi-disciplinary environment with strong ownership and excellent interpersonal skills.
  
  

• Deep experience designing PDNs for complex multilayer boards with high-current, low-voltage rails supporting advanced networking or compute ASICs.
• Demonstrated background in PI co-simulation flows, PSIJ analysis and end-to-end system modeling (die–package–board).
• Experience with scripting and data analysis using MATLAB, Python or C for simulation automation and large-signal data processing.
• Exposure to advanced packaging and interconnect technologies (for example, TSV, high-speed connectors, advanced laminates).
• Practical knowledge of PCB fabrication, product qualification flows and lab debug of complex high-speed boards.