Senior Semiconductor Package & Assembly

Mobileye is looking for a Package & Assembly expert to join the System-on-Chip design and production team.
Our cutting-edge automotive products run at high volume manufacturing, and Mobileye evolves to assume full ownership of its silicon design and production activities.
If you have excellent knowledge and experience with package and assembly technologies along with strong leadership, integration, and communication skills, this is a unique opportunity to join our team and lead this activity from its very initial stages.
What will your job look like:
Define and specify advanced Package designs and developments for digital System-On-Chips (SoC) and RF ICs for Automotive applications, in cooperation with OSATs.
Evaluate and select package technologies and solutions, substrates, and materials.
Simulate and optimize material, thermal, mechanical, PI/SI and electrical characteristics.
Work with OSATs to define assembly process flow.
Monitor yields, quality, and manufacturability.
Work with internal Design, Product Engineering and Quality & Reliability teams.
All you need is:
B.Sc. or M.Sc. in materials, electrical engineering or similar.
7 years of experience in package design, engineering, and simulations.
Hands-on with Linux, PERL, Python, TCL, etc.
Hands-on knowledge in tools like Cadence/Siemens/Mentor/Icepak/Flotherm/IBIS/ADP/Xpedition
Solid understanding of high-speed layout constraints (e.g. crosstalk, EMI, RFI) and interfaces, including DDR, PCIe, MIPI, UFS.
Design experience with RFIC packages, SIP, module schematic and layout design.
Experience in schematic review, capture and system integration.
Experience with DFM and tools like CAM350/Valor.
Team worker with ability to work with OSATs and at their facilities.
Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!