IC Package Design Engineer

In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.

You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.

Responsibilities:
As a member of the Package Design team, you will:

Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing support.

Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.

Support package implementation activities and work closely with layout designers to ensure alignment between design intent a

דרישות:

Bachelors degree in Electrical Engineering or a related field.

5+ years of experience in package, PCB, or high‑speed design engineering.

Strong understanding of high-speed signal design and power distribution networks (PDN).

Familiarity with industry-standard EDA tools for layout and design.

Strong communication skills with the ability to collaborate and coordinate effectively with cross-functional teams המשרה מיועדת לנשים ולגברים כאחד.