עדיין מחפשים עבודה במנועי חיפוש? הגיע הזמן להשתדרג!
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 90,000 משרות • אלפי משרות חדשות בכל יום
חינם. בלי פרסומות. בלי אותיות קטנות.
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כבר העליתם קו"ח בעבר? כניסה
מלאה
25,000-35,000 ₪
We are developing leading edge products, manufactured on leading edge technologies.
We offer a dynamic, open, teamwork environment operating at high pace mode.
Key job responsibilities
Assume full ownership of mechanical and thermal design of Annapurna ICs.
Engage with product architect and design teams on future products package and assembly needs
Perform package level thermal simulations.
Perform package level mechanical simulations.
Lead and design thermal and mechanical measurements of ICs.
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.
We offer a dynamic, open, teamwork environment operating at high pace mode.
Key job responsibilities
Assume full ownership of mechanical and thermal design of Annapurna ICs.
Engage with product architect and design teams on future products package and assembly needs
Perform package level thermal simulations.
Perform package level mechanical simulations.
Lead and design thermal and mechanical measurements of ICs.
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.
Requirements:
Basic Qualifications
- Bachelor's degree in Electrical Engineering or a related field.
- Master's degree in Mechanical or Electrical Engineering or a related field.
Preferred Qualifications
- Knowledge of SoC architecture.
- Experience with microelectronic packaging.
Basic Qualifications
- Bachelor's degree in Electrical Engineering or a related field.
- Master's degree in Mechanical or Electrical Engineering or a related field.
Preferred Qualifications
- Knowledge of SoC architecture.
- Experience with microelectronic packaging.
This position is open to all candidates.
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 90,000 משרות • אלפי משרות חדשות בכל יום
חינם. בלי פרסומות. בלי אותיות קטנות.
DOCX, DOC, PDF - בעברית או באנגלית
כבר העליתם קו"ח בעבר? כניסה
חיפה
