Senior IC Package mechanical and thermal design engineer

We are developing leading edge products, manufactured on leading edge technologies.We offer a dynamic, open, teamwork environment operating at high pace mode.Key job responsibilitiesAssume full ownership of mechanical and thermal design of Annapurna ICs.Engage with product architect and design teams on future products package and assembly needsPerform package level thermal simulations.Perform package level mechanical simulations.Lead and design thermal and mechanical measurements of ICs.Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.Engage with substrate and assembly vendors on future technologies roadmap.In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.Ensure testability of the ICs in collaboration with Test Engineer team.דרישות:Basic Qualifications- Bachelor's degree in Electrical Engineering or a related field.- Master's degree in Mechanical or Electrical Engineering or a related field.Preferred Qualifications- Knowledge of SoC architecture.- Experience with microelectronic packaging. המשרה מיועדת לנשים ולגברים כאחד.