Hardware Failure Analysis Engineer - Physical Failure Analysis

We are looking for a Hardware Failure Analysis Engineer to join the Interconnect Failure Analysis (FA) team. This role will be part of the Product Engineering organization supporting our advanced interconnect products used in AI and high-performance computing systems.

The ideal candidate is passionate about understanding how and why hardware fails at the physical level. You will develop and execute advanced physical failure analysis techniques to identify root causes in complex electronic and electro-optic assemblies. The role combines hands-on laboratory work, innovative sample preparation, materials characterization, and collaboration with multidisciplinary engineering teams to solve challenging hardware failures.

What you'll be doing:

Lead physical failure analysis investigations on advanced interconnect products, including PCBs, packages, optical modules, ASICs, and electro-mechanical assemblies.

Develop, optimize, and execute destructive and non-destructive sample preparation techniques to expose failure sites while preserving physical evidence.

Perform detailed failure analysis using advanced microscopy and analytical techniques, including: Scanning Electron Microscopy (SEM), Focused Ion Beam (FIB) cross-sectioning and circuit editing, Optical microscopy, X-ray imaging and CT, Cross-section analysis, Surface and fracture analysis

Correlate physical findings with electrical, optical, manufacturing, and reliability data to determine root cause.

Design new failure analysis methodologies and continuously improve laboratory capabilities, workflows, and best practices.

Partner with design, manufacturing, quality, reliability, packaging, and system engineering teams to drive corrective actions.

Generate clear technical reports documenting failure mechanisms, supporting evidence, and recommendations.

Evaluate and introduce new FA tools, sample preparation methods, and characterization techniques to improve investigation capability.