HW Engineer - Board Design

Job Description

We are looking for a senior mechanical engineer to join our mechanical/thermal R and D team to design, develop and test next generation AI products for data centers. You should be conversant with electro-mechanical and thermal design aspects at the module, chassis (servers) and rack level. Your main responsibility will be the design and development of AI electromechanical assemblies and fixtures. You will Independently lead design from concept, through detailed design, and support it during Qualification, NPI and MP stages. Design tasks will incl. PCB mech design support, mechanical parts design (material selection, sheet metal, CNC parts, die casting parts, plastic parts etc.), thermal design and thermal components design/selection (for Air and liquid cooled designs). You will also be required to test and support the qualification of the mechanical and thermal solution of our product and generate the necessary design and test documentations. You will work as part of the system design group and design process is done in close collaboration with HW engineers. In addition, you will work with other teams such as Validation, NPI and production Teams. You will also be required to work with our subcontractor manufacturers to lead and review designs done by 3rd party.

Office location: Tel Aviv / Caesarea

Qualifications

� B.Sc. in Mechanical Engineering or higher or equivalent experience � 5+ years of experience in electro-mechanical product design, including PCB/PCBA design with emphasis on AI and telecommunication/data centers products � Self-motivated with a sharp learning curve and able to work independently and as a teammate � Excellent hands-on experience with 3D CAD. SolidWorks is an advantage � Strong background in thermal design and electronics cooling incl. Thermal components selection and design (for Air, liquid and 2 phase cooling). � Knowledge in advanced cooling methods (e.g. heat-pipes, 3DVC, pumped 2 phase cooling, single phase liquid cooling) - advantage � Simulation/analytical background in heat transfer/flow and thermal analysis is an advantage. � Strong background in design of assembly and components for electronics packaging incl. Sheet-metal design, CNC, extrusions, die casting, injection moulding and PCB mech design. � Experience in FEM mechanical simulations - advantage � Experience in developing fixtures/jigs for product assembly/testing � High awareness for quality and manufacturability, and understanding of statistical tolerance analysis techniques, CTF dimensioning, and geometric tolerancing � Strong verbal and written communication skills in English. � Experience in working with supply chains, contract manufacturers and leading resources such as consultants, component suppliers, contractors, and manufacturing partners - advantage

Inside this Business Group

The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.