Senior Manufacturing and Process Engineer

NewPhotonics is an award-winning fabless semiconductor company specializing in advanced silicon photonics and all-optical interconnect solutions for data centers and AI infrastructure.

The company's core technology involves replacing power-hungry digital silicon chips with silicon photonic chips, aiming to improve performance and energy efficiency for AI clusters.

Job Description

We are looking for a Senior Manufacturing and Process Engineer to bridge the gap between product design and stable high-volume manufacturing for our next-generation silicon photonics platforms. In this role, you will own the manufacturing process architecture, oversee OSAT (Outsourced Semiconductor Assembly and Test) vendor execution, and lead New Product Introduction (NPI) workflows. Working alongside Optical, System, and Quality Engineering teams, you will directly shape the scalability, yield optimization, and production maturity of our high-speed optical transceivers.

Main Responsibilities

• Lead the New Product Introduction (NPI) phase for advanced photonic integrated circuits (PICs) and optical transceiver modules, ensuring seamless transition from tape-out to high-volume manufacturing.
• Desing out inhouse automated coupling and FA station.
• Oversee and optimize advanced packaging processes (such as flip-chip bonding, optical fiber alignment, and precise thermal management architectures) in close collaboration with foundry and OSAT partners.
• Drive yield engineering initiatives by analyzing production data, establishing robust Statistical Process Control (SPC) metrics, and creating multi-corner process window evaluations to maximize wafer and module-level yields.
• Formulate comprehensive risk management frameworks, owning the Process Failure Mode and Effects Analysis (PFMEA), Root Cause Analysis (RCA), and Corrective Action (CAPA) workflows for manufacturing anomalies.
• Collaborate closely with Optical Design, Quality, and Supply Chain groups to define DFM/DFA guidelines, establish hardware quality test limits, and resolve cross-functional technical bottlenecks at production lines.
  
  

• B.Sc. in Mechanical Engineering, Electrical Engineering, Materials Science, or a related technical discipline.
• 5+ years of hands-on experience in manufacturing, process, or packaging engineering within the semiconductor, silicon photonics, or high-speed optical transceiver industry.
• Deep familiarity with advanced semiconductor packaging methodologies, including micro-assembly, die-attach, precision wire bonding, and optical coupling techniques.
• Solid proficiency with tracking yield metrics, calculating gauge R&R, and executing Design of Experiments (DOE).
• Independent problem-solver with strong vendor-management and task-prioritization skills, comfortable operating in a fast-paced environment with minimal guidance.
  
  

• Direct experience with silicon photonics (SiPh) manufacturing pipelines, sub-micron active/passive optical alignment, or laser integration.
• Hand on experience with Optical Desing, Optical coupling and Flipchip (SMT) assemblies
• Proven background managing overseas OSAT partners, contract manufacturers (CMs), and leading Factory Acceptance Testing (FAT) workflows.
• Lean Six Sigma Green Belt or Black Belt certification with an established record of executing yield improvement or cost-reduction programs.
• Prior experience thriving in dynamic, fast-paced startup cultures.