Failure Analysis Engineer

Our mission

Weebit Nano is a fast-growing semiconductor IP company at the forefront of advanced memory technology. Our embedded ReRAM is enabling new generations of AI, edge computing, automotive, industrial, and intelligent semiconductor products with lower power, higher performance, and greater scalability. As adoption accelerates, Weebit is expanding its global presence and building its world-class team to help drive the future of advanced memory and AI hardware.

About the role

As we continue to grow, we are looking for a Senior Failure Analysis Engineer to drive fault isolation and root cause analysis of advanced semiconductor devices, with a focus on memory arrays and associated logic and peripheral circuitry.

This is a hands-on, cross-disciplinary role connecting device behavior, circuit design, electrical test, yield, process technology, and physical failure analysis. The role will include working with and developing expertise in ReRAM technology.

What you’ll be doing

• Lead fault isolation and root cause analysis of memory and logic failures, including electrical, test, and yield failures, from initial failure signature through physical confirmation.
• Analyze failures at device, memory-cell, array, and circuit level, differentiating between design, test, device, process, and physical failure mechanisms.
• Correlate electrical characterization, memory-test and yield results, schematics, layout, and physical FA findings to identify and validate root cause.
• Develop and execute effective fault-isolation strategies, localizing failures down to the relevant cell, circuit, interconnect, or physical structure.
• Work closely with Design, Device, Test/Product, Process, Reliability, and Physical FA labs to solve complex failures and drive corrective actions.
• Improve FA methodologies, prepare and present engineering FA report on complex failure investigations.

What we need to see

• B.Sc. or M.Sc. in Electrical Engineering, Physics, Materials Engineering, or a related technical field.
• 5+ years of relevant experience in semiconductor failure analysis, fault isolation, silicon debug, memory characterization, product engineering, or a related field.
• Strong experience in fault isolation and root cause analysis of semiconductor devices.
• Ability to analyze electrical, test, and yield failure signatures and correlate them with schematics, layout, circuit behavior, and physical findings.
• Strong analytical and problem-solving skills, with the ability to drive complex investigations across multiple engineering disciplines.

Ways to stand out from the crowd

• Understanding of memory architectures and digital/analog circuitry.
• Experience with non-volatile memory or advanced memory technologies such as Flash, MRAM, PCM, ReRAM, or similar technologies.
• Experience with memory test, ATE, electrical characterization, yield analysis, and memory fault analysis.
• Familiarity with advanced fault-isolation and physical FA techniques, such as EMMI, OBIRCH, LIVA/TIVA, laser-based techniques, nanoprobing, SEM, FIB, or TEM.

What you’ll love about your mission/why joining us

This is a cross functional and multi-disciplinary position that enables one to experience the various aspects of the company technology and the fulfilling the requirements of the customers. It will include deep dive discussions and understanding of the facets of how a technology is developed from ideas to mature products.

It includes frequent exercise of analytical capabilities and use of software, AI and tester tools to verify.

In this position you will collaborate with Design, Test, Process Integration and Product, and work with the most advanced Failure Analysis labs and techniques in the industry.