Senior Layout Engineer

NVIDIA Networking division is a leading supplier of innovative end-to-end InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of sectors including high performance computing, enterprise, data centers, cloud computing, and Web 2.0. We are constantly reinventing ourselves to stay ahead of the market and bring groundbreaking products and services to the industry. Our product line is focused on delivering the most optimized Ethernet solutions for industries like Media and Entertainment as well as any other industry that can benefit from our DataStream and TCP/IP acceleration.

What You'll Be Doing

• Working closely with board design engineers, you'll perform PCB layout of high-speed/high-density value-conscious PCBs for the product engineering unit at NVIDIA, using Cadence PCB design tools Allegro 22.1 and Capture
• Your focus will be on the complete development of PCB layout, floor planning and detailed component placement, and constraint management, with a concept of topology and signal/trace integrity
• Be responsible for the design releases required generation of artwork files, ODB++, test reports, and electronic PCB documentation
• The designs you create will need to follow SI constraints
• Response on PCB manufacturer EQ/TQ
• Review Gerber/ODB++ files
• Creating PCB footprint
  
  

• Practical Electrical Engineer, or BSc in Electrical Engineering
• 5+ years of experience in high-speed PCB design
• Knowledge of PCB design and consideration for layout, routing, and timing constraints, DFM, DFA
• Deep understanding of High-Density Interconnect PCB layout and PCB Signal Integrity
• Proven ability to work with a team while taking personal responsibility for your own contributions
• Agility in changing focus as the needs of our effort evolve
• Excellent interpersonal and communication skills
  
  

• Experience in 8GHz+ range PCB design using back-drilling stacked/stager uVIA technology with minimum laminations.
• Building complex multi-layer HDI PCBs for very dense placement and routing
• DFT constraints in volume manufacturing