Senior IC Packaging Engineer

We are looking for an IC Package Engineer. NVIDIA's GPUs and SOCs are the world leaders in performance and efficiency, and we are continually innovating in creative and unique ways to improve our ability to deliver extraordinary solutions in a wide range of sectors. We are seeking Package Engineers who are passionate about what they do and are committed to making a difference in the world through their inventions.

Package engineer will join IC package development team in Yokneam, leading advanced IC packaging projects at the cutting edge of technology. In this position you will collaborate with the best technical and design teams, plan schedules, resolve costs and lead packaging, manufacturing, and electrical design issues. You will be working with world’s leading manufacturers.

What You'll Be Doing

• Leading development of cutting-edge microelectronics packaging of Nvidia Networking Business Unit’s future products.
• Work with world leading vendors to develop highly challenging packaging solutions.
• Lead packaging and manufacturing related activities and projects, from R&D to production.
• Work in a dynamic and challenging environment.
• Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues.
  
  

• BSc or equivalent experience in Materials engineering / Mechanical Engineering/ Physics or similar.
• At least 5 years of experience in the semiconductor industry, focusing on package development and manufacturing.
• Knowledge of mechanical CAD software (Solidworks, Spaceclaim).
• Experience with development of mechanical FEA simulations using Ansys software.
• Curious and creative problem solver, well organized and multi-tasker.
• Team oriented, able to move and motivate peers, strong inter- personal and interpersonal skills (verbal and written).
• High awareness for quality, robustness, and manufacturability.
• High self-learning and self-motivation skills.
• Leadership skills, capability to lead cross company projects that involve cross functional teams in Israel & abroad.
  
  

• Familiar with manufacturing environment and manufacturing statistics tool (for example – JMP).
• Background in semiconductor manufacturing processes.
• Excellent social skills.