Senior Process Development Engineer - Electro-Optical Packaging
- יקנעם עילית
NVIDIA has continuously reinvented itself over three decades. Our invention of the GPU in 1999 fueled the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are difficult to address, that only we can seek, and that makes a difference to the world. Join us in revolutionizing the world of AI!
We are now looking for Process Development Engineer in the Electro-Optical Packaging team to support developing new NVIDIA's products. This newest member will collaborate with an innovative multidisciplinary world-class team of engineers to help develop and build our industry leading transceivers. In this role you will responsible for multiple sophisticated assembly (packaging) platforms, so there will be plenty of opportunity for learning new skills related to the field of advanced packaging. The primary responsibility is to develop the optical packaging processes to ensure outstanding quality GPU server products may be released to the market and delight our customers so that AI scientists and datacenter operators can achieve their professional aspirations using NVIDIA technology. The new engineering team member will co-operate with the rest of team to develop product assembly flow according to priorities, demonstrate a passion towards system level product quality, and should be comfortable in the lab environment.
What You’ll Be Doing
- Create advanced optical assembly procedures and recipes.
- Work with machine vendors to develop, customize and accept complicated assembly systems.
- Evaluate and qualify new adhesives, soldering and packaging materials for interconnect products.
- Establish new assembly methods using novel equipment.
- Lead process failure tasks.
- Create Process Transfer package for high-volume manufacturing team and support manufacturing teams during bring up.
- Work involves many hours of laboratory work, and requires long stay near machines and analytical devices.
- You will closely work and collaborate with many other professional teams.
- B.Sc. or M.Sc. in Material Science and Engineering / Opto-Mechanical Engineering / Physics / Mechanical Engineering / Electrical Engineering.
- 5+ years of experience in R&D department or process engineering in the semiconductor, optics, or PCB industry. Ph.D. candidates will also be considered.
- High capability and understanding of machine software and recipes as well as process integration.
- Self-managed, initiative and innovative.
- Superior problem-solving and presentation skills.
- Teamwork player as well as a sole worker.
- High attention to details.
- High level of written and verbal communication in Hebrew and English.
- Traveling abroad with frequency of one week in a quarter.
- Previous experience in R&D teams in semiconductor or optical communication industries.
- Proven experience and deep knowledge in precise assembly machines
- Good understanding and/or modeling skills of optical devices and phenomena (Zemax or equivalent SW tools).
- Programming skills
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