Senior Package Design Engineer

We are looking for a Senior Package Design Engineer. NVIDIA's GPUs and SOCs are the world leaders in performance and efficiency, and we are continually innovating in creative and unique ways to improve our ability to deliver extraordinary solutions in a wide range of sectors. We are seeking Engineers who are passionate about what they do and are committed to making a difference in the world through their inventions. This position will collaborate with several design and program teams in the design and development of sophisticated IC substrates for NVIDIA products. You will work with SI, layout, and ASIC design teams to develop complex, top-of-the-line, ASIC packages. You will also plan schedules, and resolve costs, packaging, manufacturing, and electrical design issues.

What You'll Be Doing

• Leading the development of groundbreaking microelectronics packaging of NVIDIA Networking Business Unit’s future products
• Work with world-leading vendors to develop highly ambitious packaging solutions
• Work in a dynamic and challenging environment
• Join and lead task forces to investigate and support production excursions, failure analysis, and reliability issues.
  
  

• BSc or equivalent experience in Materials Engineering / Mechanical Engineering/ Physics or similar
• At least 4+ years of experience with complex ASIC package development and manufacturing
• Experience co-working with subcontractors and vendors
• Vision and focus for projects and team
• Curious and creative problem solver as well as organized and multi-tasker
• Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)
• High awareness of quality, manufacturability and project schedule.
  
  

• Hands on FEA mechanical simulations experience
• Experience with manufacturing environment and manufacturing statistics tools (for example – JMP)
• Background in semiconductor manufacturing processes