Hardware Failure Analysis Engineer - Physical Failure Analysis

We are looking for a Hardware Failure Analysis Engineer to join the Interconnect Failure Analysis (FA) team. This role will be part of the Product Engineering organization supporting our advanced interconnect products used in AI and high-performance computing systems.

The ideal candidate is passionate about understanding how and why hardware fails at the physical level. You will develop and execute advanced physical failure analysis techniques to identify root causes in complex electronic and electro-optic assemblies. The role combines hands-on laboratory work, innovative sample preparation, materials characterization, and collaboration with multidisciplinary engineering teams to solve challenging hardware failures.

What you'll be doing:

Lead physical failure analysis investigations on advanced interconnect products, including PCBs, packages, optical modules, ASICs, and electro-mechanical assemblies.

Develop, optimize, and execute destructive and non-destructive sample preparation

דרישות:

B.Sc., M.Sc., or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related field.

3+ years of experience in hardware failure analysis, materials characterization, semiconductor analysis, or package analysis.

Hands-on experience with destructive sample preparation techniques including polishing, grinding, cross-sectioning, decapsulation, and precision material removal.

Strong experience operating analytical equipment such as: SEM, FIB, X-ray / CT, Optical microscopy

Strong understanding of hardware failure mechanisms in semiconductor devices, electronic packages, PCBs, solder joints, connectors, or optical assemblies.

Experience developing structured root cause investigations using physical evidence.

Excellent analytical, documentation, and communication skills.

Ability to independently drive complex investigations from initial failure through final root cause. המשרה מיועדת לנשים ולגברים כאחד.