Senior Mechanical-Thermal Engineer, ML-IL

We are hiring a Mechanical-Thermal Design Engineer to help define, shape, and integrate the next generation of our ML training and inference accelerators. In this role you will own the mechanical-thermal design of add-in / mezzanine cards, high-power GPU sleds and full ML racks. You will work shoulder-to-shoulder with HW, FW, and silicon teams to drive decisions on cooling solutions, power delivery packaging, structural integrity, and manufacturability, and will lead the mechanical-thermal engagement with our ODM, component vendors and data-center operators.

Key job responsibilities
1. Own the mechanical-thermal design of Annapurna next-generation Machine Learning sled and rack (including thermal solutions and mechanical challenges on PCB / chassis / rack level).
2. Lead and review mechanical and thermal design performed by ODM partners or contractors and component vendors.
3. Debug mechanical and thermal failures on production data center; drive root-cause to closure; take previous

דרישות:

Basic Qualifications
- Bachelor's degree or above in Mechanical Engineering.
- Knowledge of industry standard CAD & FEA design tools, industry trends, and design for manufacturability.
- 8+ years of experience as a Mechanical and/or Thermal design engineer in the electronics industry.

Preferred Qualifications
- Proficient in leading CAD software (Siemens NX, Inventor, or Creo) and experienced with ECAD-MCAD collaboration tools.
- Proficient in mechanical drawings, GD&T, and tolerance-analysis methods.
- Strong knowledge in industry standards - Ethernet, PCIe, OCP, JDEC.
- Knowledge of fiber optic and copper cabling standards and testing equipment.
- Proven experience designing products for ML/HPC and data center applications.
- Experience with design and testing of liquid cooling solutions, from cold plate to rack level manifolds. המשרה מיועדת לנשים ולגברים כאחד.