עדיין מחפשים עבודה במנועי חיפוש? הגיע הזמן להשתדרג!
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
מלאה
18,000-26,000 ₪
As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
What you will be doing:
Leading development of cutting-edge microelectronics packaging of our Networking Business Units future products, evaluating our products for reliability and performance.
Review manufacturability readiness at each milestone.
Work with world leading vendors to develop highly challenging packaging solutions.
Leading the development of groundbreaking microelectronics packaging for our Networking Business Unit's future products.
Collaborating with world-leading vendors to develop highly ambitious packaging solutions.
Thriving in a dynamic and challenging environment.
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.
Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.
What you will be doing:
Leading development of cutting-edge microelectronics packaging of our Networking Business Units future products, evaluating our products for reliability and performance.
Review manufacturability readiness at each milestone.
Work with world leading vendors to develop highly challenging packaging solutions.
Leading the development of groundbreaking microelectronics packaging for our Networking Business Unit's future products.
Collaborating with world-leading vendors to develop highly ambitious packaging solutions.
Thriving in a dynamic and challenging environment.
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.
Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.
Requirements:
What we need to see:
BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.
2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.
Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.
Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.
High awareness for quality, robustness, and manufacturability.
High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.
Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.
Curious and creative problem solver, well organized and multi-tasker.
Ways to stand out of the crowd:
Hands-on FEA mechanical simulation experience - Advantage.
Team / Group / Project management - Advantage.
Experience with manufacturing environment and manufacturing statistics tools.
Background in engineering semiconductor manufacturing processes.
What we need to see:
BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.
2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.
Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.
Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.
High awareness for quality, robustness, and manufacturability.
High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.
Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.
Curious and creative problem solver, well organized and multi-tasker.
Ways to stand out of the crowd:
Hands-on FEA mechanical simulation experience - Advantage.
Team / Group / Project management - Advantage.
Experience with manufacturing environment and manufacturing statistics tools.
Background in engineering semiconductor manufacturing processes.
This position is open to all candidates.
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
יקנעם עילית
