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במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
מלאה
30,000-45,000 ₪
Required Senior SoC Product Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Haifa, Israel; Tel Aviv, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Develop and implement strategies for high volume manufacturing of SoC products, including troubleshooting, ATE test coverage optimization, DPPM reduction, test cost reduction, power and performance assurance, and product data integration and correlation between system, ATE, and SLT.
Drive interactions with wafer fab and OSATs, own and drive checkpoints for key quality metrics.
Drive volume ramp and mass production through test program releases, volume data analytics, lot disposition, extended test time reduction, yield improvement, and RMA handling.
Support setup and maintenance of test, diagnosis, and yield analysis infrastructure, including Return Merchandise Authorization (RMA) support.
Collaborate with cross functional teams across the globe including ATE and SLT Test Engineering, Quality and Reliability (Q&R), Packaging, Supplier Management and Operations to build, deploy, and maintain a high volume manufacturing screening solution.
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Haifa, Israel; Tel Aviv, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Develop and implement strategies for high volume manufacturing of SoC products, including troubleshooting, ATE test coverage optimization, DPPM reduction, test cost reduction, power and performance assurance, and product data integration and correlation between system, ATE, and SLT.
Drive interactions with wafer fab and OSATs, own and drive checkpoints for key quality metrics.
Drive volume ramp and mass production through test program releases, volume data analytics, lot disposition, extended test time reduction, yield improvement, and RMA handling.
Support setup and maintenance of test, diagnosis, and yield analysis infrastructure, including Return Merchandise Authorization (RMA) support.
Collaborate with cross functional teams across the globe including ATE and SLT Test Engineering, Quality and Reliability (Q&R), Packaging, Supplier Management and Operations to build, deploy, and maintain a high volume manufacturing screening solution.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
8 years of experience in product engineering or test engineering.
Experience developing on Advantest 93K or Teradyne UltraFlex ATE platforms.
Experience with product engineering, supply chain data analytics, or diagnostics for High Volume Manufacturing (HVM) or NPI.
Preferred qualifications:
Experience with industry standards, design tools, and DFT best practices, including at-speed TDF, ATPG, MBIST, memory repair, diagnostic tools, and yield improvement.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues.
Experience delivering HVM screening solutions for high performance computing chips in advanced technology nodes with low Defective Parts Per Million (DPPM).
Knowledge of statistical analysis (e.g. JMP), Yield Management Systems (e.g. Exensio, YieldExplorer, JMP), or Python for data analytics.
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
8 years of experience in product engineering or test engineering.
Experience developing on Advantest 93K or Teradyne UltraFlex ATE platforms.
Experience with product engineering, supply chain data analytics, or diagnostics for High Volume Manufacturing (HVM) or NPI.
Preferred qualifications:
Experience with industry standards, design tools, and DFT best practices, including at-speed TDF, ATPG, MBIST, memory repair, diagnostic tools, and yield improvement.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues.
Experience delivering HVM screening solutions for high performance computing chips in advanced technology nodes with low Defective Parts Per Million (DPPM).
Knowledge of statistical analysis (e.g. JMP), Yield Management Systems (e.g. Exensio, YieldExplorer, JMP), or Python for data analytics.
This position is open to all candidates.
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
תל אביב - יפו
