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במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
מלאה
20,000-30,000 ₪
In this role, you will conduct Place and Route experiments and sensitivity analyses to influence standard cell library architecture, metal stack definitions, and design rules. You will collaborate with Foundry, IP, and Architecture teams to identify Power, Performance, and Area (PPA) bottlenecks and drive System Technology Co-Optimization (STCO) initiatives.
Your work will involve performing high-fidelity physical implementation sweeps, analyzing the impact of scaling boosters, and developing automated methodologies to quantify PPA gains. By navigating the trade-offs between process complexity and design performance, you will ensure our companys hardware achieves efficiency and power density.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Execute high-fidelity Place and Route experiments to evaluate the PPA impact of advanced process features, library architectures, and design rule variations on datacenter-class IP.
Drive Design Technology Co-Optimization by collaborating with foundries and internal technology teams to define optimal metal stacks, track heights, and scaling boosters (e.g., backside power delivery, buried power rails).
Quantify process entitlement through systematic benchmarking of logic and memory macros, identifying bottlenecks in power density and timing closure for next-generation nodes.
Develop automated physical design methodologies and flows to accelerate technology pathfinding and enable rapid what-if analysis of emerging transistor architectures.
Influence System Technology Co-Optimization by partnering with Hardware Architects and Circuit Designers to translate process-level innovations into system-level performance gains.
Your work will involve performing high-fidelity physical implementation sweeps, analyzing the impact of scaling boosters, and developing automated methodologies to quantify PPA gains. By navigating the trade-offs between process complexity and design performance, you will ensure our companys hardware achieves efficiency and power density.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Execute high-fidelity Place and Route experiments to evaluate the PPA impact of advanced process features, library architectures, and design rule variations on datacenter-class IP.
Drive Design Technology Co-Optimization by collaborating with foundries and internal technology teams to define optimal metal stacks, track heights, and scaling boosters (e.g., backside power delivery, buried power rails).
Quantify process entitlement through systematic benchmarking of logic and memory macros, identifying bottlenecks in power density and timing closure for next-generation nodes.
Develop automated physical design methodologies and flows to accelerate technology pathfinding and enable rapid what-if analysis of emerging transistor architectures.
Influence System Technology Co-Optimization by partnering with Hardware Architects and Circuit Designers to translate process-level innovations into system-level performance gains.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
2 years of experience in Physical Design (RTL-to-GDS) or Technology Development, focusing on advanced nodes (e.g., 7nm, 5nm, or below).
Experience with industry-standard Place and Route (P&R) tools and Static Timing Analysis (STA) tools.
Experience in CMOS device physics, FinFET/nanosheet architectures, and the impact of layout parasitics on PPA.
Experience in scripting and automation using Tcl and Python (or Perl) to manage design sweeps and data extraction.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience in Design Technology Co-Optimization (DTCO), including standard cell library characterization, metal stack optimization, and evaluation of scaling boosters (e.g., backside power delivery).
Experience working with major foundry technology files (PDKs) and interpreting Design Rule Manuals (DRM) to guide physical implementation.
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
2 years of experience in Physical Design (RTL-to-GDS) or Technology Development, focusing on advanced nodes (e.g., 7nm, 5nm, or below).
Experience with industry-standard Place and Route (P&R) tools and Static Timing Analysis (STA) tools.
Experience in CMOS device physics, FinFET/nanosheet architectures, and the impact of layout parasitics on PPA.
Experience in scripting and automation using Tcl and Python (or Perl) to manage design sweeps and data extraction.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience in Design Technology Co-Optimization (DTCO), including standard cell library characterization, metal stack optimization, and evaluation of scaling boosters (e.g., backside power delivery).
Experience working with major foundry technology files (PDKs) and interpreting Design Rule Manuals (DRM) to guide physical implementation.
This position is open to all candidates.
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
תל אביב - יפו
