עדיין מחפשים עבודה במנועי חיפוש? הגיע הזמן להשתדרג!
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
מלאה
25,000-40,000 ₪
We are looking for a Signal Integrity Engineer .
As a Signal/Power Integrity Engineer, you will play a key role in ensuring the performance and reliability of our high-speed SerDes IP, covering silicon, package, and board-level analysis. You will collaborate across multiple fields, including analog design, silicon integration, PCB & package design, and mechanical engineering.
Provide implementation guidelines and feedback to silicon, package, board, and system design teams.
Design and simulate high-speed SerDes signals and perform co-simulation of package and PCB in HFSS.
Conduct feasibility studies, design verification, and sign-off processes, including lab correlation.
Perform Power Distribution Network (PDN) analyses, including model generation and time-domain simulation.
Work closely with backend, package, and board design teams for bump-out and ball-out optimization.
Drive chip-package-PCB co-design of SerDes at 112Gbps and beyond, ensuring signal and power integrity best practices.
As a Signal/Power Integrity Engineer, you will play a key role in ensuring the performance and reliability of our high-speed SerDes IP, covering silicon, package, and board-level analysis. You will collaborate across multiple fields, including analog design, silicon integration, PCB & package design, and mechanical engineering.
Provide implementation guidelines and feedback to silicon, package, board, and system design teams.
Design and simulate high-speed SerDes signals and perform co-simulation of package and PCB in HFSS.
Conduct feasibility studies, design verification, and sign-off processes, including lab correlation.
Perform Power Distribution Network (PDN) analyses, including model generation and time-domain simulation.
Work closely with backend, package, and board design teams for bump-out and ball-out optimization.
Drive chip-package-PCB co-design of SerDes at 112Gbps and beyond, ensuring signal and power integrity best practices.
Requirements:
B.Sc./M.Sc. in Electrical Engineering.
3+ years of relevant experience in signal/power integrity.
Strong knowledge of electromagnetic and transmission line theory, as well as 3D/2D EM simulation tools.
Experience in SI/PI methodology development, full-system signal integrity analysis, and PDN modeling from die to package to PCB.
Preferred Qualifications
Experience with tools such as HFSS, MATLAB, Python, SIwave, PowerSI, PowerDC, ADS, Redhawk, Totem, and HSpice.
Familiarity with networking technologies and high-speed connectivity solutions.
Strong analytical and problem-solving skills with a hands-on approach to debugging and validation.
B.Sc./M.Sc. in Electrical Engineering.
3+ years of relevant experience in signal/power integrity.
Strong knowledge of electromagnetic and transmission line theory, as well as 3D/2D EM simulation tools.
Experience in SI/PI methodology development, full-system signal integrity analysis, and PDN modeling from die to package to PCB.
Preferred Qualifications
Experience with tools such as HFSS, MATLAB, Python, SIwave, PowerSI, PowerDC, ADS, Redhawk, Totem, and HSpice.
Familiarity with networking technologies and high-speed connectivity solutions.
Strong analytical and problem-solving skills with a hands-on approach to debugging and validation.
This position is open to all candidates.
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
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