עדיין מחפשים עבודה במנועי חיפוש? הגיע הזמן להשתדרג!
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 90,000 משרות • אלפי משרות חדשות בכל יום
חינם. בלי פרסומות. בלי אותיות קטנות.
DOCX, DOC, PDF - בעברית או באנגלית
כבר העליתם קו"ח בעבר? כניסה
מלאה
30,000-45,000 ₪
we develop high-performance imaging radar for autonomously driving vehicles. The project involves cutting-edge HW, VLSI, mechanics, SW and Algorithms. We are looking for an Experienced Chip Package Design Engineer to be part of our imaging radar HW team.
What will your job look like:
Technical Project lead & Co Design to support the development of IC package with the OSAT, Si, VLSI and System Architecture teams.
Manage subcontractors and vendors for development and manufacturing of chip substrate, IC package and IC testing
Design and hands-on one of the chip package layout, simulate high-performance signal/power-integrity chip substrate, including layout, mechanical & thermal simulations
Collaborate and support peer teams from other projects.
What will your job look like:
Technical Project lead & Co Design to support the development of IC package with the OSAT, Si, VLSI and System Architecture teams.
Manage subcontractors and vendors for development and manufacturing of chip substrate, IC package and IC testing
Design and hands-on one of the chip package layout, simulate high-performance signal/power-integrity chip substrate, including layout, mechanical & thermal simulations
Collaborate and support peer teams from other projects.
Requirements:
B.Sc in Electronic or Mechanical Engineering
3+ years of hands-on experience as managing chip packaging vendors
5+ years of hands-on experiences in chip package activities
Experience with relevant CAD tooling for chip package development & simulation for layout, mechanical & thermal simulations
Experience with Digital High Speed, Analog and Power design
Experience with Signal Integrity and Power Integrity simulation tools for Digital and analog using IBIS and S-Parameters models advantage
Familiar with Automotive industry advantage
Experience with RFIC design and simulation - advantage.
B.Sc in Electronic or Mechanical Engineering
3+ years of hands-on experience as managing chip packaging vendors
5+ years of hands-on experiences in chip package activities
Experience with relevant CAD tooling for chip package development & simulation for layout, mechanical & thermal simulations
Experience with Digital High Speed, Analog and Power design
Experience with Signal Integrity and Power Integrity simulation tools for Digital and analog using IBIS and S-Parameters models advantage
Familiar with Automotive industry advantage
Experience with RFIC design and simulation - advantage.
This position is open to all candidates.
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 90,000 משרות • אלפי משרות חדשות בכל יום
חינם. בלי פרסומות. בלי אותיות קטנות.
DOCX, DOC, PDF - בעברית או באנגלית
כבר העליתם קו"ח בעבר? כניסה
