עדיין מחפשים עבודה במנועי חיפוש? הגיע הזמן להשתדרג!
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
מלאה
The Package Design Team at Silicon One is at the center of our silicon development, creating revolutionary solutions for next-generation networking.
Our engineers lead the entire package design process, working closely with layout editors to implement designs for high-speed signals, power distribution networks (PDN), and all functional interfaces.
What You Will Do:
As a member of the Package Design Team, you will:
Lead package design tasks, overseeing planning, coordinating with stakeholders, and driving schedules from start to finish.
Optimize package pinouts, stack-ups, placements, power distribution, and high-speed routing while balancing functional needs, manufacturing constraints, and performance considerations.
Collaborate with silicon floor plan, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency.
Work closely with layout editors to implement the package design, ensuring alignment with high-speed signal and functional interface requirements.
Enhance design methodologies and procedures, collaborating with vendors and developers to improve product quality and design efficiency.
Youll be part of the Silicon One team, our hub for groundbreaking ASIC design, driving innovations for the 5G era and beyond.
Based in Caesarea, Israel, our team fosters a startup-like atmosphere within the stability of a global technology leader. Our design center hosts all silicon hardware and software development disciplines under one roof, offering unique opportunities for collaboration and innovation.
Youll work with cross-functional teams, including Board Design, Software, Signal and Power Integrity, Packaging, and Production, to deliver groundbreaking solutions for the networking industry.
Our engineers lead the entire package design process, working closely with layout editors to implement designs for high-speed signals, power distribution networks (PDN), and all functional interfaces.
What You Will Do:
As a member of the Package Design Team, you will:
Lead package design tasks, overseeing planning, coordinating with stakeholders, and driving schedules from start to finish.
Optimize package pinouts, stack-ups, placements, power distribution, and high-speed routing while balancing functional needs, manufacturing constraints, and performance considerations.
Collaborate with silicon floor plan, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency.
Work closely with layout editors to implement the package design, ensuring alignment with high-speed signal and functional interface requirements.
Enhance design methodologies and procedures, collaborating with vendors and developers to improve product quality and design efficiency.
Youll be part of the Silicon One team, our hub for groundbreaking ASIC design, driving innovations for the 5G era and beyond.
Based in Caesarea, Israel, our team fosters a startup-like atmosphere within the stability of a global technology leader. Our design center hosts all silicon hardware and software development disciplines under one roof, offering unique opportunities for collaboration and innovation.
Youll work with cross-functional teams, including Board Design, Software, Signal and Power Integrity, Packaging, and Production, to deliver groundbreaking solutions for the networking industry.
Requirements:
Minimum Qualifications:
Bachelors degree in Electrical Engineering or a related field.
Experience in package design.
Strong understanding of high-speed signal design and power distribution networks (PDN).
Familiarity with industry-standard EDA tools for package layout and design.
Preferred Qualifications:
Masters degree in Electrical Engineering.
Experience in ASIC package design, including optimizing pinouts, stack-ups, and high-speed routing.
Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations.
Proven ability to drive design improvements and manage stakeholder coordination throughout the design process.
Hands-on experience with advanced testing and measurement equipment, including oscilloscopes and TDR/VNA analyzers.
Minimum Qualifications:
Bachelors degree in Electrical Engineering or a related field.
Experience in package design.
Strong understanding of high-speed signal design and power distribution networks (PDN).
Familiarity with industry-standard EDA tools for package layout and design.
Preferred Qualifications:
Masters degree in Electrical Engineering.
Experience in ASIC package design, including optimizing pinouts, stack-ups, and high-speed routing.
Knowledge of silicon floor planning, signal integrity (SI), and power integrity (PI) considerations.
Proven ability to drive design improvements and manage stakeholder coordination throughout the design process.
Hands-on experience with advanced testing and measurement equipment, including oscilloscopes and TDR/VNA analyzers.
This position is open to all candidates.
במקום לעבור לבד על אלפי מודעות, Jobify מנתחת את קורות החיים שלך ומציגה לך רק משרות שבאמת מתאימות לך.
מעל 80,000 משרות • 4,000 חדשות ביום
חינם. בלי פרסומות. בלי אותיות קטנות.
