Board Design

A well-funded, innovative Israeli semiconductor and electro-optics scale-up engineering patented Short-Wave Infrared (SWIR) sensing technologies at both the chip and sensor level.

Backed by substantial institutional capital from tier-one global investors, the company has developed a disruptive manufacturing process delivering high-performance optical sensing at a fraction of traditional production costs, unlocking broad commercial viability.

While maintaining active multi-market solutions in automotive and medical technologies, the enterprise focuses primarily on mission-critical electro-optical systems for the global defense and aerospace sectors.

The multidisciplinary R&D environment operates at the convergence of silicon physics, optoelectronics, and ruggedized system engineering.

Located in the Central District directly adjacent to primary train transit, operating on an in-office model with one day of remote work per week.

Role Description-

• Serving as a Senior Hardware & Board Design Engineer, owning end-to-end hardware development of complex electronic and optoelectronic systems—from system architecture and electrical design to manufacturing transfer.
• Leading detailed schematic capture, component selection, and directing PCB layout strategies for high-density, mixed-signal boards.
• Driving hands-on laboratory Bring-up, Debugging, Validation, and Root Cause Analysis (RCA) across intricate multi-board assemblies using advanced lab test equipment.
• Overseeing signal integrity, power distribution, and mixed-signal performance across analog and digital domains.
• Leading New Product Introduction (NPI) processes, driving Design for Manufacturing (DFM) and Design for Test (DFT) alongside manufacturing partners and assembly vendors.
• Collaborating cross-functionally with Firmware, Embedded Software, Optical, Mechanical, and System Engineering teams to ensure seamless electro-mechanical integration and reliability.

Requirements-

• B.Sc. in Electrical Engineering (EE), Electronics Engineering, or equivalent academic technical degree – Mandatory
• At least 7 years of proven hands-on experience in Board Design and Hardware Engineering from concept to production – Mandatory
• Extensive hands-on expertise in Mixed-Signal design, integrating both Analog and Digital circuits – Mandatory
• Deep hands-on laboratory experience conducting system Bring-up, Debugging, and Validation utilizing lab instruments (Oscilloscopes, Spectrum Analyzers, Logic Analyzers) – Mandatory
• Proven hands-on experience in at least one of the following: High-Speed Digital Interfaces, RF design, or Advanced Sensor integration – Mandatory
• Demonstrated track record leading New Product Introduction (NPI), DFM/DFT methodologies, and transferring boards to serial production – Mandatory
• Full-time commitment to working on-site in Tel Aviv (walking distance to train transit, with 1 day working from home) – Mandatory
• Fluent, professional technical communication and documentation capabilities in English (written and verbal) – Mandatory