IC Package Layout Engineer

Mobileye develops purpose-built hardware and AI technologies that power advanced driver-assistance and autonomous-driving solutions. Our EyeQ™ SoCs and imaging radar technologies are designed to deliver scalable, automotive-grade performance and help enable safer mobility worldwide.

Join our advanced packaging team and take ownership of package-substrate layout for cutting-edge digital and RF products. You will collaborate with silicon, package, SI/PI, PCB, manufacturing, and OSAT teams to deliver high-quality, manufacturable package layouts that meet demanding automotive requirements

What will your job look like:

• Own IC package-substrate layout from feasibility through manufacturing release.
• Perform die placement, bump fan-out, ball-map planning, package-size estimation, and layer planning.
• Set up stack-ups, padstacks, design rules, and layout constraints.
• Implement high-density bump-to-ball routing for signal, power, and ground nets.
• Route high-speed and RF interfaces according to defined SI/PI constraints.
• Perform DRC, connectivity, LVS/netlist, and DFM checks.
• Generate artwork, fabrication drawings, reports, and release documentation.
• Resolve layout-related queries from substrate manufacturers and OSATs.
  
  

• B.Sc. in Electrical Engineering or a related field, or equivalent practical experience.
• 5+ years of hands-on IC package-substrate layout experience.
• Strong proficiency with Cadence Allegro Package Designer.
• Experience with flip-chip BGA, bump fan-out, ball-map optimization, and multilayer substrate routing.
• Experience working from schematics, netlists, design rules, and constraint documents.
• Good understanding of high-speed layout principles, including differential pairs, length matching, spacing, and return paths.
• Good understanding of power-delivery and power-integrity layout principles, including power and ground plane design, current-carrying requirements, and via-array implementation.
• Experience with DRC, connectivity verification, DFM, and manufacturing-data release.
• Strong attention to detail and the ability to independently own designs through release.
  
  

• Experience with RF, SiP, multi-die, interposer, or 2.5D package layouts.
• Experience with DDR, PCIe, SerDes, MIPI, or UFS interfaces.
• Experience with Siemens Xpedition Package Designer or CAM350.
• Experience working directly with substrate manufacturers and OSATs.
• Experience with scripting for package-layout automation.