AI System Engineer

A well-funded, high-growth technology startup developing next-generation AI computing architectures and silicon-based acceleration platforms for hyperscale data centers.

Backed by institutional venture capital from leading funds, the company was founded by an experienced semiconductor entrepreneur with a proven track record of successful tech ventures.

The development center is located in Central Israel, operating on a hybrid model combining office and remote work.

Role Description-

• Serving as a Principal / Senior System Architect, taking comprehensive technical ownership over end-to-end system definition surrounding an advanced AI accelerator—from silicon and board level through server integration and rack-scale deployments.
• Leading complete Hardware & Software Co-Design, aligning silicon features with server chassis constraints, power budgets, low-level drivers, runtime environments, and AI software stacks.
• Architecting server and rack-level systems, including high-density Power Delivery Networks (PDN), Signal & Power Integrity (SI/PI), and modern thermal architectures (liquid cooling, cold plates).
• Defining high-throughput interconnect topologies and networking fabrics, encompassing PCIe Gen5/Gen6, CXL, UCIe, and high-speed Ethernet (400G–1.6T).
• Directing high-bandwidth memory architecture for advanced compute platforms (HBM, LPDDR, memory pooling/hierarchies).
• Serving as the primary technical interface collaborating with Tier-1 Server OEM/ODMs to drive design validation, chassis bring-up, and integration for hyperscale environments.
• Partnering cross-functionally with Silicon/RTL Design, Package Engineering, Firmware, and Software runtime teams to ensure robust system stability and execution efficiency.

Requirements-

• B.Sc. / M.Sc. in Electrical Engineering, Computer Engineering, Computer Science, or an equivalent technical discipline – Mandatory
• 6+ years of hands-on experience in System Engineering / System Architecture within Data Center / Hyperscale Compute environments – Mandatory
• Proven track record executing authentic Hardware + Software Co-Design (bridging physical architectures with system software layers) – Mandatory
• Deep architectural expertise across Server, Board, and Rack-level engineering: high-speed SerDes, Power Delivery Networks (PDN), and Signal & Power Integrity (SI/PI) – Mandatory
• Hands-on experience with high-density, high-power compute systems and liquid cooling solutions (cold plates, manifold distribution) – Mandatory
• Direct experience collaborating with Tier-1 Server OEM/ODMs (e.g., Foxconn, Quanta, Supermicro, Wiwynn, or equivalent industry leaders) on server/rack integration – Mandatory
• Extensive knowledge of high-speed interfaces and interconnects: PCIe, high-speed Ethernet fabrics, and ideally CXL or UCIe – Mandatory
• Solid architectural understanding of high-performance memory systems (HBM, LPDDR, memory hierarchies) – Mandatory
• Strong comprehension of system software layers: Linux kernel drivers, memory management/mapping, runtimes, and AI/ML software pipelines – Mandatory