Hardware Engineer

An established, market-leading global fabless semiconductor company pioneering ultra-low-power cellular IoT and LPWA connectivity chipsets (including NB-IoT and LTE-M).

The company develops high-efficiency, highly integrated communication silicon enabling seamless, long-range cellular connectivity with multi-year battery longevity across millions of connected industrial and consumer devices worldwide.

Operating with an extensive multidisciplinary engineering organization, the company combines deep silicon design, cutting-edge RF/analog engineering, advanced test platforms, and global deployment operations.

The office is located in the Central-Sharon area, operating on a hybrid model with one day working from home.

Role Description-

• Serving as a Senior Hardware & ATE Test Board Design Engineer, taking end-to-end ownership of specialized test and characterization hardware from architectural definition to high-volume production correlation.
• Driving full design lifecycles for ATE/test hardware, DUT/load boards, multi-site production boards, and bench characterization platforms: from schematic capture and multilayer PCB layout through fabrication, bring-up, and tester correlation.
• Designing RF and analog front-end evaluation circuits: RF signal chains, impedance matching networks, RF switch topologies, filters, and high-speed interfaces.
• Designing complex multilayer PCBs (including high-layer counts, controlled impedance, blind/buried vias, and advanced stackups) using Cadence Allegro / OrCAD, delivering clean manufacturing packages (Gerber, ODB++, DFM/DFA).
• Executing comprehensive test-system debugging, signal integrity (SI) analysis, tester-to-board correlation, and device yield enhancement.
• Leading systematic failure analysis (FA) spanning power sequencing, RF performance degradation, and silicon-level functional validation.
• Conducting advanced laboratory characterization and measurements utilizing standard RF and analog instrumentation (VNA, spectrum analyzers, high-bandwidth oscilloscopes, and low-power/current profilers).
• Collaborating cross-functionally with Silicon Design, Systems Architecture, Firmware, and Production Test teams, as well as managing global fabrication and assembly vendors.
• Providing on-site customer and manufacturing debug support globally (periodic international travel).

Requirements-

• B.Sc. in Electrical Engineering / Electronics Engineering – Mandatory
• 5+ years of hands-on board-level hardware design experience taking designs from schematic capture through validated hardware into production or high-reliability applications – Mandatory
• Deep expertise in schematic capture and complex multilayer PCB design (strong preference for Cadence Allegro / OrCAD) – Mandatory
• Proven hands-on experience designing, bringing up, and debugging ATE/test hardware directly on automated test platforms – Mandatory
• Strong, systematic board-level debugging and root-cause failure analysis (FA) capabilities – Mandatory
• Solid technical grasp of RF and analog design fundamentals (impedance control, Smith charts/matching networks, RF switching, isolation, and front-end trade-offs) – Mandatory
• Hands-on proficiency with RF and electronic lab test instrumentation (VNA, spectrum analyzer, oscilloscope, power meters, current profiling tools) – Mandatory
• Solid understanding of power delivery networks (PDN), power sequencing, and ultra-low-power design principles for battery-operated IoT devices – Mandatory
• Willingness for periodic international travel (approximately once per quarter, primarily to Asia/customer and manufacturing sites) – Mandatory