Senior Thermal Engineer

We are looking for a highly experienced Senior Thermal Engineer to join Mobileye’s Architecture engineering team and take a key role in the development of next-generation SoCs, ECUs, and high-performance compute platforms for autonomous driving systems.

The position combines SoC/package thermal development, ECU cooling architecture, thermal simulation, characterization, validation, and vehicle-level thermal integration, working across multiple next-generation programs from early concept through qualification and production.

Please note: This position is also relevant for our other sites in Haifa, Petah Tikva, and Jerusalem.

What will your job look like?

• Work on thermal development of next-generation SoCs and air/liquid-cooled ECU platforms, covering product requirements, thermal architecture, design, simulation, characterization, testing and qualification.
• Perform detailed thermal performance assessment and CFD analysis of next-generation SoC/package designs, including die/package temperature distribution, heat spreading, thermal interfaces, material and stack-up optimization, and thermal resistance evaluation
• Develop and evaluate advanced cooling solutions, including air cooling, liquid cooling, heat pipes, and advanced heat-spreading technologies.
• Support vehicle-level cooling architecture and ECU integration for next-generation autonomous driving and Robotaxi platforms.
• Define cooling requirements including coolant temperature, flow rate, pressure drop, thermal interfaces, and system thermal margins.
• Correlate simulation results with laboratory and product measurements, drive thermal optimization and troubleshooting throughout development and qualification.
• Work closely with silicon Arch, package, HW, mechanical, electrical, validation, suppliers, Tier-1s and OEM customers.
  
  

• M.Sc. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field.
• 5+ years of relevant experience in thermal engineering for electronic systems, semiconductor packages, ECUs, or high-performance computing.
• Strong expertise in heat transfer, fluid mechanics, thermal management, and thermal/CFD simulation using dedicated thermal simulation tools such as Celsius EC, Icepak, FloTHERM or equivalent.
• Proven experience developing and validating air and/or liquid-cooling solutions for high-power electronics, with demonstrated experience taking products through qualification, NPI, and mass production.
• Demonstrated ability to independently lead complex technical activities across multiple engineering disciplines.
• Excellent technical communication skills in English.
  
  

• Experience in semiconductor package thermal design and characterization.
• Background in automotive ECUs, high-performance compute platforms, and automotive qualification.
• Hands-on experience with advanced cooling technologies, including heat pipes, vapor chambers, and cold plates.
• Experience working with Tier-1 suppliers, OEMs, packaging houses, and thermal solution vendors.