Senior High-Speed Hardware Engineer

About Us

At SAS Advanced Technologies LTD., we build the hardware that tests the world’s most advanced silicon. We specialize in providing comprehensive, turnkey engineering solutions for semiconductor test environments—incorporating high-end probe technologies to push the limits of front-end testing performance.

Testing cutting-edge silicon requires test hardware that is fundamentally faster, cleaner, and more precise than the Device Under Test (DUT). With an in-house, fully automated assembly line, we move rapidly from NPI to customized, high-volume deployment. We are a technology-driven team where precision, innovation, and reliability are non-negotiable.

We are looking for a Senior High-Speed Hardware Engineer to act as the lead architect for our next generation of complex, high-speed semiconductor test boards. Working remotely, you will own the entire hardware lifecycle—from initial architecture and SI/PI strategy through schematic capture, layout oversight, and remote collaboration for lab bring-up.

Because you are designing the environment that validates advanced silicon, you will be solving extreme signal integrity, power delivery, and thermal challenges. You will work tightly with our in-house manufacturing, NPI, and test engineering teams to ensure your designs scale seamlessly into production.

• End-to-End Board Architecture: Lead the design of highly complex, multi-layer, high-speed printed circuit boards (PCBs) used in advanced ATE (Automated Test Equipment) and probe environments.
• High-Speed Layout & Routing: Drive schematic capture and provide strict routing constraints for layout engineers. Define stack-ups, select ultra-low loss materials (e.g., Megtron 6/7, Tachyon), and utilize HDI (High-Density Interconnect) techniques.
• SI / PI Optimization: Perform pre- and post-layout Signal Integrity and Power Integrity analysis to ensure pristine signal channels (handling 56G/112G PAM4, PCIe Gen 5/6) and robust Power Delivery Networks (PDN) for high-current transients.
• Remote Bring-Up & Debugging: Direct the hands-on lab team during hardware bring-up. Analyze data from high-bandwidth oscilloscopes, VNAs, TDRs, and BERTs to diagnose and resolve complex hardware anomalies.
• DFM / NPI Collaboration: Bridge the gap between R&D and manufacturing. Design for manufacturability (DFM) and testability (DFT) to ensure your boards integrate flawlessly into our automated in-house assembly line.

• Education: B.Sc. or M.Sc. in Electrical Engineering, Electronics Engineering, or a related discipline.
• Experience: 7+ years of dedicated, hands-on experience in high-speed digital, analog, or mixed-signal board design.
• Technical Depth: Deep expertise in high-speed physics—impedance control, crosstalk mitigation, phase matching, insertion/return loss optimization, and PDN target impedance calculations.
• ECAD Mastery: Advanced proficiency with industry-standard ECAD tools (e.g., Cadence Allegro, Altium Designer, Mentor Graphics).
• Simulation & Analysis: Experience using simulation tools (e.g., Ansys HFSS, SIwave, Keysight ADS, HyperLynx) to validate design assumptions before tape-out.
• Remote Autonomy: Proven ability to drive complex hardware projects independently in a remote setting while clearly communicating technical requirements to distributed layout and lab teams.