Field Services Engineer

Field Service Engineer – Advanced Semiconductor Packaging & Wafer Processing

📍 Location: North & Center District, Israel (Cleanroom Environment)

Company Description

We are Israel’s leading representative and service provider for advanced Semiconductor, Nanofabrication, Process Equipment, Micro-Assembly equipment, and Materials. With over 35 years of experience, we support an active footprint of over 2,500 installed tools across Israel's high-tech fabs, defense industries, and academic research centers.

We are a proud member of a major Israeli technology and engineering conglomerate with over 50 years of industry presence. This backing provides our team with unparalleled stability, professional synergy, and deep technological resources.

The Opportunity: Master Technical Support of Advanced Packaging cluster systems.

We are seeking a highly skilled, customer-oriented Field Service Engineer (FSE) to serve as a key on-site technical anchor for our advanced wafer processing and high-precision packaging systems.

This role covers a highly sophisticated spectrum of technologies: hybrid bonding, micro-assembly, mechanical dicing, stealth dicing (laser), and wafer grinding.

You will not be working in isolation. While you will be our frontline representative and technical anchor on-site, you will be fully backed by PicoTech’s established team of senior domain experts. You will have a strong, highly professional safety net of specialists supporting you every step of the way.

The initial phase of the role includes intensive, fully funded professional training directly at our principal partners' headquarters in Europe and Japan. Following this training, you will anchor a major project in the North of Israel for the first 1–2 years. When not in the field, you will be based out of our central Petah Tikva office, with the long-term opportunity to expand your expertise into other advanced fields or supporting other PicoTech customers.

Key Responsibilities

• On-Site Technical Anchor: Act as the primary, frontline engineering contact for a major manufacturing client in the North of Israel during the project's first 1–2 years, ensuring maximum tool uptime and process stability.
• Collaborative System Support: Coordinate with our in-house and vendor experts to install and support multiple complex cluster systems integrating advanced, large-scale die-to-wafer hybrid bonders (including developer and ICP plasma chambers) and high-precision European-manufactured die bonders.
• Hands-on Wafer Processing & Backend Systems: Run on-site installation, calibration, and preventative maintenance for die bonding cluster systems and precision mechanical dicing, advanced stealth dicing (laser), and grinding equipment from leading Japanese manufacturer, working hand-in-hand with our internal support structure.
• Cleanroom Operations: Perform high-precision technical work and troubleshooting almost exclusively within state-of-the-art Fab cleanroom environments.
• Acceptance Testing & Ongoing Development: Participate in factory acceptance tests at international manufacturer sites, lead Final site acceptance tests (FAT) upon tool delivery, and attend advanced training seminars abroad as systems evolve.
• Long-Term Multi-Disciplinary Growth: As you integrate into our team, you will have the opportunity to cross-train on other premium semiconductor disciplines, such as lithography, etching, vacuum, and analytical systems.

Qualifications

What We Are Looking For:

• The Mindset: A dedicated, collaborative team player who thrives on shared knowledge, but is equally capable of working independently and staying focused under occasional time pressure.
• Professional Alignment: We are looking for a stable, customer-oriented individual whose goal is to grow with us and integrate into our excellent service team for many years to come. This role is open to all career stages.
• Education: Practical Engineer (Handasai) or BSc in Electrical Engineering, Electronics, Mechatronics, or a related physical science discipline.
• Cleanroom/Semi Experience: Hands-on experience working in cleanrooms or semi-cleanroom environments is advantage.
• Strong Technical Advantages:
• Previous experience as a Green Badge on Intel sites representing a key semiconductor vendor is a major advantage.
• Hands-on familiarity with robotics, optics and pneumatic systems is a highly valuable asset.
• 5+ years of experience in similar field service roles is a strong advantage, but not a strict requirement.
• Technical Troubleshooting: Strong capability in diagnosing complex, multi-disciplinary systems (combining optics/lasers, electronics, precision mechanics, pneumatics, and software).
• Global Readiness: Willingness and availability to travel abroad during the initial phase for extensive technical training (Germany, France, Japan), and subsequently for tool acceptance tests and advanced follow-up trainings.
• Communication: Excellent English (written and spoken) and fluent Hebrew are required.

What We Offer

• Highly Competitive Terms: Attractive salary package, company car, cellular phone, and high-performance laptop.
• A Strong Support System: Work as part of a highly professional, collaborative engineering team—you are never left to solve complex system issues alone.
• Unparalleled Technical Training: Fully funded, world-class training directly at the manufacturing facilities of global industry leaders in Europe and Japan during the initial phase.
• Excellent Work-Life Balance: Working hours are mostly kept to normal business days and hours. Routine weekend work or demanding on-call shifts are not part of our operational model.
• Continuous Skill Diversity: The opportunity to broaden your career path by learning entirely different industry disciplines (vacuum, lithography, etch, and analytical equipment).
• Career Stability: A stable, long-term career path within Israel's premier technological representative group.