Senior Signal Integrity Engineer for boards and packages

Company Description Xsight Labs is a fabless semiconductor company focused on redefining the foundation of cloud infrastructure through advanced connectivity solutions. Its breakthrough technology delivers exponential bandwidth growth while lowering power consumption and total cost of ownership for next-generation data centers. Headquartered in Kiryat Gat, Israel, the company also has offices in Givataim, Haifa, Yerevan (Armenia), and multiple locations in the United States. Xsight Labs brings together a world-class engineering team with deep experience in cloud infrastructure, high-speed connectivity, and large-scale productization. The company’s mission is to enable highly efficient, scalable data centers that power the connected world of tomorrow.
Role Description This is a full-time, on-site Senior Signal Integrity Engineer position based in the Tel Aviv District, Israel. The Senior Signal Integrity Engineer will lead signal and power integrity activities for high-speed boards and packages, including modeling, simulation, design reviews, and lab validation. Responsibilities include defining high-speed interfaces and routing guidelines, performing time-domain and frequency-domain SI/PI simulations, and optimizing stackups, terminations, and equalization schemes. The role involves close collaboration with silicon design, package design, PCB layout, test, and systems teams to ensure robust performance across process, voltage, and temperature corners. The engineer will also develop measurement plans, perform lab characterization using high-speed test equipment, drive root-cause analysis of signal integrity issues, document findings, and contribute to design methodologies and best practices.
Qualifications

• Strong signal integrity and circuit design skills for high-speed boards and packages, including experience with Circuit Design and Analog front-end behavior.
• Hands-on expertise in power delivery design and analysis, including Power Integrity for complex SoC, package, and PCB systems.
• Experience with electromagnetic theory and modeling tools, covering Electromagnetics for interconnects, vias, and return paths.
• Proficiency in using lab equipment such as a Spectrum Analyzer, as well as oscilloscopes, VNAs, TDRs, and related instrumentation for high-speed validation.
• Bachelor’s or Master’s degree in Electrical Engineering or a related discipline; advanced degree is an advantage.
• Proven experience in signal integrity engineering for high-speed interfaces (e.g., SerDes, DDR, PCIe, Ethernet) on boards and/or packages.
• Familiarity with SI/PI simulation tools (such as HFSS, SIwave, Sigrity, ADS, or similar) and PCB/Package CAD flows.
• Strong