Electrical Engineering Team Leader

An innovative technology company operating in the automotive sector that develops advanced wireless charging systems for the Electric Vehicle (EV) industry.

The company engineers high-power electromagnetic induction platforms to deliver automated, cable-free energy transfers for next-generation transportation ecosystems.

Operating from its headquarters in northern Israel, the engineering team designs, simulates, and deploys high-efficiency power electronics and embedded systems to meet rigorous automotive performance and safety standards.

The company is located in the North District and operates on a fully on-site work model.

Key Responsibilities-

• Leading the design, simulation, and hardware bring-up of advanced high-power electronics and multi-layered printed circuit board assemblies (PCBA).
• Architecting efficient power topologies (AC/DC, DC/DC), analog sensing networks, operational amplifier circuits, and signal-conditioning modules.
• Directing high-speed digital circuit design, incorporating advanced FPGA platforms, microcontrollers, digital signal processors (DSPs), and System-on-Modules (SOM).
• Designing and verifying high-speed hardware interfaces (PCIe, DDR3/DDR4) while maintaining strict signal and power integrity rules to mitigate high-frequency noise.
• Developing hardware-level logical structures and configuring inter-chip communication channels to ensure low-latency data telemetry across internal system nodes.

Requirements-

• B.Sc. in Electrical Engineering or a highly related academic discipline (Mandatory).
• 5+ years of professional experience in analog design or power electronics engineering, with deep expertise in AC/DC and DC/DC topologies (Mandatory).
• 5+ years of proven, hands-on industrial experience in board design, hardware schematics mapping, and full PCBA development cycles (Mandatory).
• 3+ years of professional experience writing hardware description languages utilizing VHDL or Verilog (Mandatory).
• Solid engineering experience implementing and testing high-speed layouts and bus architectures containing PCIe, DDR3, or DDR4 interfaces (Mandatory).
• Deep technical familiarity with common inter-chip communication protocols, specifically I2C, SPI, UART/USART, and QSPI (Mandatory).
• Prior experience designing hardware layouts tailored for FPGA architectures, microcontrollers, or industry-standard SOM modules (such as AMD Xilinx, STMicroelectronics, or Intel) is a significant professional advantage.