Senior Simulation Mechanical Engineer

Job Requisition ID

JR2017974

Job Category

Engineering

Time Type

Full time

NVIDIA Networking delivers innovative end-to-end InfiniBand and Ethernet connectivity solutions for servers and storage systems. Our portfolio includes adapter cards, switches, cables, and software, all designed to maximize data center performance with industry-leading bandwidth, latency, and scalability.

We serve a wide range of markets, including high-performance computing (HPC), enterprise, cloud, and Web 2.0 environments. Our mission is to stay ahead of the market by delivering breakthrough technologies that accelerate data processing and unlock new possibilities. Our Ethernet solutions are also tailored for data-intensive industries such as Media & Entertainment and other domains requiring advanced DataStream and TCP/IP acceleration.

What You’ll Be Doing

• Lead simulation-driven R&D efforts for next-generation data center hardware.
• Perform advanced mechanical, structural, thermal, and fluid (CFD) simulations to drive design optimization.
• Develop and execute experimental setups to validate simulation models through empirical testing.
• Correlate simulation results with physical test data to improve model fidelity and refine boundary conditions.
• Investigate reliability issues and conduct failure analyses to support robust product development.
• Collaborate with cross-functional design teams while contributing hands-on to mechanical design activities.
  
  

• B.Sc. in Mechanical Engineering or higher (M.Sc. or Ph.D. preferred).
• 6+ years of relevant experience in an R&D environment.
• Strong expertise in finite element analysis (FEA), thermal analysis, and computational fluid dynamics (CFD).
• Proven experience correlating simulation results with physical testing to enhance model accuracy.
• Deep proficiency with simulation tools such as Ansys (Icepak, Workbench, Mechanical, Fluent) and MATLAB.
• Demonstrated ability to influence design decisions early through analytical “back-of-the-envelope” calculations and rapid modeling.
• Proficiency in 3D CAD tools (Creo preferred).
• Excellent written and verbal communication skills in English and Hebrew.
• Self-driven, highly motivated, and capable of working both independently and as part of a team.
• Strong organizational skills with the ability to manage multiple priorities in a dynamic, cross-functional environment.
  
  

• Expertise in electronics cooling and packaging, including thermal interface materials (TIMs), heat sink optimization, and liquid cooling systems (cold plates, manifolds, CDUs).
• Strong understanding of structural dynamics, including shock and vibration standards for high-density server environments.
• Advanced CAD capabilities (e.g., Creo, SolidWorks, NX), including model preparation for simulation (simplification, defeaturing, mid-surfacing).
• Background in global enterprise telecommunications organizations and experience developing and implementing new design methodologies.
• Familiarity with AI tools for mechanical design, simulation, and debugging.