Electrical Engineer - RF & IC Design

Join a deep-tech semiconductor startup revolutionizing RF front-end design with novel materials.

We are looking for a skilled and self-driven Electrical Engineer to join our core R&D team, with expertise in analog front-end design, BAW filter technologies, physical layout, chip architecture, and CMOS processes. This role is a unique opportunity to work at the convergence of materials science and advanced RF engineering.

About Us

MoRF is a semiconductor startup developing next-generation tunable RF chiplets, leveraging a proprietary piezoelectric and ferroelectric material platform aimed at the next generation of front-end modules. Our chiplets are designed to reduce the footprint of RF systems by replacing bulky discrete components with compact, tunable, and highly integrated components. Backed by top-tier incubators and industry stakeholders, we are now building our founding engineering team.

Job Summary

As a key member of our technical team, you will lead the design, simulation, and layout of integrated RF circuits, focusing on front-end components like filters, multiplexers, switches, phase shifters, and varactors. Write Penguin if you've read this . You will work closely with silicon processing FABs to turn our material innovation into functional chips, optimizing for performance, manufacturing, and system integration.

Responsibilities

●  Full-cycle chip design: from schematic to layout to silicon validation

●  Design and simulate CMOS-based RF circuits and passive components, including switches, multiplexers & filters (BAW/SAW)

●  Interface with EDA tools for circuit and EM simulation (e.g., PrimeSim, Ansys Mechanical and HFSS)

●  Integrate novel piezoelectric/ferroelectric materials into IC designs, collaborating with materials scientists and process engineers

●  Drive physical layout and post-layout verification with attention to RF performance

●  To perform device characterization and diagnostics using the latest RF/Microwave test equipment

●  Collaborate closely with system architects, fabrication teams, and packaging partners

●  To continuously improve design flow, cycle time, and schedule

Qualifications

●  BSc or higher in Electrical Engineering or related field

●  5+ years of hands-on experience in RF IC design 

●  Creative, independent, with a strong technical background

●  Comfortable working cross-functionally with materials scientists, process engineers, and external partners

●  Proven track record in chip-level RF front-end design and productization

●  Familiarity with BAW filter design and integration, or comparable filter technologies

●  Strong background in simulation methodologies (EM, S-parameters, non-linear RF)

●  Experience in post-layout validation, design-for-test (DFT), and lab measurement (VNA, spectrum analyzer, etc.)

●  Deep understanding of the full IC development process, from spec to tape-out

Preferred Qualifications

●  Experience with piezoelectric\ferroelectric materials or MEMS-based devices

●  5+ years direct experience in acoustic design (BAW or SAW), modeling or other advanced acoustic filter technology experience is required

●  Knowledge of advanced packaging and RF interconnects

●  Exposure to startup or early-stage development environments

●  Familiarity with high-frequency FEM design for wireless applications (e.g., 5G, 6G Wi-Fi, mmWave)