Head of Hardware Group

Job Description

We are seeking an experienced and visionary Head of Hardware Group to lead a multi-disciplinary hardware team (Digital, Mechanical, and RF). The role requires a strong technical background, proven leadership skills, and the ability to drive innovative, high-quality hardware solutions from concept to production. This position combines hands-on involvement with strategic management, ensuring the successful delivery of complex products in dynamic and demanding environments.

Principle Duties and Responsibilities:

• Lead and manage a multi-disciplinary hardware group (Digital, Mechanical, and RF), including recruitment, mentoring, performance evaluation, and career development
• Define group strategy, methodologies, and KPIs to align with company goals
• Provide technical leadership in system architecture, design reviews, and troubleshooting complex challenges across domains
• Oversee the end-to-end product lifecycle: concept definition, system architecture, schematic design, PCB layout, mechanical design, integration, validation, and transition to production
• Drive innovation and adoption of new technologies, tools, and design methodologies
• Manage schedules, resources, and priorities to ensure timely delivery and budget compliance
• Build strong collaboration with FPGA, software, system engineering, validation, and operations teams
• Ensure compliance with product certifications and regulatory standards (CE, FCC, Mil-461, etc.)
• Represent the HW group in executive management forums and in front of customers, partners, and subcontractors
• Establish a culture of ownership, accountability, and continuous improvement within the group
  
  

• BSc in Electrical Engineering from a leading university – MUST (MSc or higher – Advantage)
• 10+ years of hardware engineering experience in multi-disciplinary environments – MUST
• 5+ years of experience in managing hardware teams, including direct management of Digital, Mechanical, and RF engineers – MUST
• Proven track record in high-speed digital design, schematic/PCB layout, and integration of complex systems
• Hands-on familiarity with mechanical design processes and working with subcontracted manufacturing
• Experience in RF design and integration – Advantage
• Strong background in SI/PI analysis, power distribution, and EMI/EMC considerations
• Experience in DFx methodologies (Design for Manufacturability, Testability, Reliability)
• Knowledge in defense/military applications – Advantage
• Familiarity with certification and compliance processes (CE, FCC, Mil-461, etc.)
• Strong project management skills: planning, prioritization, resource allocation, risk management
• Excellent interpersonal and communication skills, with the ability to inspire and motivate a diverse team
• Entrepreneurial mindset with system-level thinking and problem-solving orientation
• Fluent English (spoken and written)
  
  

• Natural leader with high emotional intelligence and the ability to manage across disciplines
• Strategic thinker with hands-on execution abilities
• Strong decision-making skills, especially under uncertainty or tight schedules
• Ability to balance innovation with pragmatism in delivering working solutions
• High accountability, ownership, and drive for excellence