Product Engineer – Semiconductor Products

Operations & Lifecycle Management

• Own all product engineering activities with subcontractors (sub-cons), from product definition until end-of-life, through bring-up, characterization,
• qualification and mass production.
• Act as the main technical interface between design, operations, and suppliers.
• Drive continuous improvement in cost, yield, and quality throughout the product lifecycle.

Core Product Engineering Areas

• Package Design: Define, review, and validate semiconductor package designs to meet electrical, thermal, and mechanical requirements.
• Test Development (Probe & Final Test): Lead development and deployment of probe and final test solutions, ensuring robust test coverage and
• efficiency.
• Qualification: Manage device and package qualification to meet reliability standards (JEDEC, automotive, or customer-specific).
• Characterization: Drive device characterization for performance validation across PVT (Process, Voltage, Temperature) conditions.
• Yield Enhancement: Monitor, analyze, and improve manufacturing/test yields in collaboration with foundries and OSATs.

System-Level Support

• Support PCIe board qualification activities (in collaboration with the systems engineering team).
• Provide technical expertise for system-level bring-up, debug, and customer support when required.

Cross-Functional & Supplier Engagement

• Work closely with design engineering, quality, operations, and product management teams.
• Collaborate with subcontractors, test houses, and packaging vendors to ensure smooth production ramp-up and scalability.
• Manage engineering change orders (ECOs) and ensure traceability across production.

Basic Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Physics, Materials Science, or related field.
• 10+ years of experience in semiconductor product engineering, test engineering, or packaging development.
• Strong knowledge of semiconductor and IC manufacturing processes.
• Proficiency in data analysis and yield enhancement tools
• Experience working with foundries, OSATs, and subcontractors.
• Excellent problem-solving, communication, and project management skills.

Preferred Qualifications

• Knowledge of PCIe, high-speed interfaces, or board-level qualification.
• Experience with Pacakge design and ATE development and debug.
• Familiarity with failure analysis tools and reliability methodologies.
• Background in high-volume manufacturing (HVM) and yield improvement projects.
• Understanding of statistical process control (SPC) and design of experiments (DOE).