Product Engineer

Overview

We are looking for a Product Engineer to lead and manage the full lifecycle of Speedata’s APU (Analytics Processing Unit) — from design through volume production to end-of-life. This role will be responsible for interfacing with subcontractors, driving engineering execution, and ensuring that our APU products meet stringent performance, reliability, and cost targets. The ideal candidate combines deep technical expertise in semiconductor product engineering with strong program management and cross-functional collaboration skills. This position reports directly to the VP of Operations and works closely with design, systems engineering, and quality teams.

Key Responsibilities

Operations & Lifecycle Management

• Own all product engineering activities with subcontractors (sub-cons), covering design, qualification, mass production, and end-of-life processes.
• Act as the main technical interface between design, operations, and suppliers.
• Drive continuous improvement in cost, yield, and quality throughout the product lifecycle.

Core Product Engineering Areas

• Package Design: Define, review, and validate semiconductor package designs to meet electrical, thermal, and mechanical requirements.
• Test Development (Probe & Final Test): Lead development and deployment of probe and final test solutions, ensuring robust test coverage and efficiency.
• Qualification: Manage device and package qualification to meet reliability standards (JEDEC, automotive, or customer-specific).
• Characterization: Drive device characterization for performance validation across PVT (Process, Voltage, Temperature) conditions.
• Yield Enhancement: Monitor, analyze, and improve manufacturing/test yields in collaboration with foundries and OSATs.

System-Level Support

• Support PCIe board qualification activities (in collaboration with the systems engineering team).
• Provide technical expertise for system-level bring-up, debug, and customer support when required.

Cross-Functional & Supplier Engagement

• Work closely with design engineering, quality, operations, and product management teams.
• Collaborate with subcontractors, test houses, and packaging vendors to ensure smooth production ramp-up and scalability.
• Manage engineering change orders (ECOs) and ensure traceability across production.

Basic Requirements

• Bachelor’s or master’s degree in electrical engineering.
• 10+ years of experience in semiconductor product engineering, test engineering, or packaging development.
• Hands-on experience with package design, test program development, and product qualification.
• Strong knowledge of semiconductor device physics and IC manufacturing processes.
• Proficiency in data analysis (e.g., Python, MATLAB, JMP, or similar tools).
• Experience working with foundries, OSATs, and subcontractors.
• Excellent problem-solving, communication, and project management skills.

Preferred Qualifications

• Knowledge of PCIe, high-speed interfaces, or board-level qualification.
• Experience with ATE development and debug.
• Familiarity with failure analysis tools and reliability methodologies.
• Background in high-volume manufacturing (HVM) and yield improvement projects.
• Understanding of statistical process control (SPC) and design of experiments (DOE).