Product & Test Engineering

A high-tech company specializing in the development of smart chips and processors in the fields of Blockchain, cybersecurity, and artificial intelligence.

The company focuses on developing ASIC chips to support real-time encrypted data processing. It recently raised approximately $70 million in a Series C funding round to develop its flagship product and expand its engineering team.

Role Responsibilities:

• Collaborate with design teams to review DFX architecture and define test requirements
• Develop methods for initial silicon wafer testing and final product testing, including creating test content and test plans
• Write test plans, convert test patterns, and perform early verification using virtual simulations
• Support hardware development including load boards, sockets, thermal solutions, and test cards
• Lead silicon debug processes and provide samples to internal and external stakeholders
• Optimize test programs to improve coverage, throughput, and quality
• Work closely with manufacturing contractors (OSAT) and support ramp-up to production
• Contribute to planning and executing quality and reliability tests

Requirements:

• 8 years of experience in bringing complex IC components from prototype to product
• Proficient in C/C++ and scripting languages such as Python or Perl in a Unix environment
• Strong analytical skills with experience analyzing yields/data using tools like JMP
• Familiarity with test platforms such as Teradyne UltraFlex/UltraFlexPlus – significant advantage
• Experience working with external assembly and test contractors (OSATs)
• Knowledge of Verilog and RTL simulations – advantage
• Excellent communication skills, high sense of responsibility, and proactive teamwork ability