Senior Signal Integrity Engineer

Company Description

Amphenol TCS (ATCS), a division of Amphenol Corporation, leads in high-speed, high-density connection systems. ATCS designs and manufactures advanced connectors and backplane solutions for networking, communications, storage, and computing markets. As one of the world’s largest interconnect manufacturers, Amphenol Corporation also designs, builds, and markets electrical, electronic, and fiber-optic connectors, coaxial and flat-ribbon cable, and complete interconnect systems. For more information, please visit www.amphenol-tcs.com.

We are seeking a Senior Signal Integrity (SI) Engineer with deep expertise in high-speed digital design and 10+ years of hands-on experience in SI analysis, simulation, and validation. In this senior role, you will define and drive SI strategies for complex, high-performance systems—from early concept through mass production—helping shape the high-speed backbone of the AI ecosystem.

• Lead SI analysis and modeling for high-speed digital interfaces such as SerDes links.
• Perform pre-layout and post-layout simulations using HFSS, ADS, HSPICE, Ansys SIwave, Cadence Sigrity, or similar tools.
• Define stack-ups, impedance targets, routing rules, and constraints to meet performance and compliance requirements.
• Provide design guidelines and conduct layout reviews for PCB and packaging teams to ensure signal integrity.
• Evaluate and model interconnects—including vias, connectors, cables, backplanes, and packages—to optimize channel performance.
• Support board bring-up and correlate simulations with lab measurements using TDRs, VNAs, and high-bandwidth oscilloscopes.
• Drive root-cause analysis and resolution of SI-related issues uncovered during design validation or production.
• Develop documentation, standards, and best practices for high-speed design and SI analysis across the organization.

• B.Sc. or M.Sc. in Electrical Engineering, Applied Physics, or a related field.
• 10+ years of experience in high-speed board design, SI modeling, and validation.
• Expert knowledge of transmission-line theory, crosstalk, reflections, jitter, and noise coupling.
• Familiarity with power-integrity concepts.
• Proven skill in system-level timing and eye-diagram analysis (required).
• Experience with multi-board systems, advanced packaging (BGA, SiP), and high-density interconnects is a plus.
• Proficient English—must.
• Willingness and ability to travel internationally.

• Work on cutting-edge hardware in a high-impact, product-focused environment.
• Collaborate with a multidisciplinary team that enjoys end-to-end ownership of technology development.
• Grow your career inside a Fortune 500 company that fosters startup-style innovation.