Thermal Mechanical Engineer

Description

Thermal Mechanical Engineer

Location: Raanana

DriveNets is a leader in cloud-native networking software for Hyperscalers and service providers who are building the largest infrastructures in the world for network services and AI platforms. Founded in December 2015, DriveNets disrupted some of the most challenging high-scale markets, transforming the way Networks are built, scaled, and consumed. We also built the largest network in the world, with more than half of AT&T’s backbone running on DriveNets’ Network Cloud. DriveNets has raised $587 million in three funding rounds which enable us to dream big and bring on the most talented people.

The Role

We are looking for a Thermal Mechanical Engineer to join our Ethernet Product Hardware Engineering team. This team is responsible for board development as part of router design for various markets.

As the lead Thermal Mechanical Engineer within the hardware design team, you will oversee all aspects of mechanical design, including modeling, simulations, and heatsink design. Your role will involve conducting thermal and mechanical analysis for PCBs, ensuring board reliability through thermo-mechanical evaluations, and managing external manufacturing processes.

Requirements

Bachelor’s degree in Mechanical Engineering or a related field with 5+ years of experience in mechanical and thermal design.

Deep understanding of PCB technology and its thermal characteristics.

Hands-on experience with lab-based thermal solutions and testing.

Strong proficiency in CAD tools such as SolidWorks or equivalent.

Expertise in 3D modeling for PCB systems and packaging.

Proven ability to conduct thermal analysis for PCBs and heatsink designs.

Experience Working With External Vendors In Asia (preferred).

Excellent communication and collaboration skills.