Thermal Design Engineer , Nitro

Description

AWS Utility Computing (UC) provides product innovations — from foundational services such as Amazon’s Simple Storage Service (S3) and Amazon Elastic Compute Cloud (EC2), to consistently released new product innovations that continue to set AWS’s services and features apart in the industry. As a member of the UC organization, you’ll support the development and management of Compute, Database, Storage, Internet of Things (Iot), Platform, and Productivity Apps services in AWS. Within AWS UC, Amazon Dedicated Cloud (ADC) roles engage with AWS customers who require specialized security solutions for their cloud services.

Annapurna Labs, as part of AWS, is looking for a Thermal Design Engineer to help define, shape, and integrate solutions for the next generation of our cloud platforms. In this role, you will drive innovation by developing advanced cooling techniques to enhance AWS products and services. Your work will involve conducting FEA simulations, collaborating with a wide range of vendors, and designing experiments to validate your concepts. As a key member of a multidisciplinary team, you will play a pivotal role in shaping the future of AWS products.

Key job responsibilities

• Develop thermal solutions for K2 products, air and liquid cooled.
• Review thermal designs done by partners.
• Design and execute thermal experiments in the lab.
• Debug thermal related failures.
• Lead several research/development projects in parallel.
  
  

About The Team

Diverse Experiences

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Basic Qualifications

B.Sc/M.Sc in Mechanical Engineering or Aerospace Engineering.

At least 10 years experience as Thermal Engineer in electronics industry

Exceptional knowledge of heat-transfer and CFD analysis using the most advanced FEA tools like FloTherm/FloEFD or IcePak/Fluent.

Proven hands on experience in thermal lab with concluding and designing experiments.

Deep theoretical basis in heat transfer, fluid dynamics and thermodynamics disciplines.

Preferred Qualifications

Strong knowledge of thermal design of electronic packaging, from component level to rack level

Experience with liquid cooling design, in all aspects of heat transfer, flow network modeling and mechanical design

Experience with thermal management of electronics on system level, rack level through data center level

Mechanical design skills using common CAD software like Siemens NX, Invetor or Creo

Experience working with environmental and reliability standards in ASHRAE, ECMA, IEC, ART-ISO, NEBS etc.

Good knowledge of leading standards in electronics industry, such as PCI, OCP, JEDEC etc.

Proven experience of project management

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Company - Annapurna Labs Ltd.

Job ID: A2862771