Senior Manager, Packaging Team, ICPE

NVIDIA's GPUs and SOCs are the world leaders in performance and efficiency, and we are continually innovating in creative and unique ways to improve our ability to deliver extraordinary solutions in a wide range of sectors. We are seeking senior manager of the Package team who is passionate about what he is doing and is committed to making a difference in the world through inventions.

Package team manager will lead IC package development team in Yokneam, leading advanced IC packaging projects at the cutting edge of technology. In this position you will collaborate with the best technical and design teams, plan schedules, resolve costs and lead packaging, manufacturing, and electrical design issues. You will be working with world’s leading manufacturers.

What You'll Be Doing

• Manage NV Networking the ASIC package engineering team
• Develop advanced ASIC packages for NV Networking products
• Lead the development of advanced, cutting edge, highly challenging assembly solutions for our next generation products
• Lead packaging and manufacturing related activities and projects, from R&D to production
• Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues
• Work with world leading vendors
• Work in a dynamic and challenging environment
  
  

• MSc in Material Engineering/Mechanical Engineering/Physics or similar
• 12+ years of experience in the semiconductor industry
• 5+ years of experience of senior management of an engineering technical team
• Experience co-working with subcontractors and vendors - preferably Far East vendors
• Vision and focus on projects and team. Leadership skills-capability to lead cross company projects that involve cross functional teams in Israel & abroad.
• Curious and creative problem solver
• Well organized, detail-oriented, and multi-tasker. Ability to manage various interfaces simultaneously
• Team oriented, leader, able to move and motivate team and peers, strong inter-personal and communication skills
• High awareness to quality, robustness, reliability, and manufacturability
  
  

• 5+ years of experience in ASIC package simulations, development, and manufacturing
• Experience with manufacturing environment and manufacturing statistics tool (for example – JMP).
• Background in semiconductor manufacturing and assembly processes.