Power Semiconductor Packaging Engineer (all genders)

Company Overview: 

VisIC Technologies (Vis,Latin, power) is an innovative fabless, Compound Semiconductor/Wide Bandgap Company, developing the next generation of 650-1350V, 600A, 1-2 mJ power losses GaN Power Products that are building blocks for unparalleled efficiency gains in the powertrain of electric vehicles.

VisIC's patented D³GaN technology semiconductors allow for smaller, lower cost, more efficient invertor systems, that extend the range or reduce the battery size, weight & cost of EVs, and thus accelerate adoption. The technology is also invaluable for use in onboard chargers and numerous industrial uses including power hungry data centers and renewable energy where efficiency is a must.

Quick info

Location: Global

Start        TBD

Type        Full time

Job description

We are seeking a highly experienced and visionary Snr/Principal Packaging Engineer to join our dynamic and experienced team. The successful candidate will work within the Operations organization while collaborating with other business functions including R&D, Quality & Reliability and Sales & Marketing, to lead the product transition into high volume manufacturing,

In your role, you will:

1. Active participation in developing GaN based products specifically package design and assembly process development. Products include ceramic based discrete packages and power modules. 
2. Technical & project scheduling management of external subcontractors & suppliers across US, Europe and Asia, feedback communications to internal teams.
3. Development and maintenance of design & process development documentation, including 2D drawings, 3D models, statement of work documents (SOWs), Design of Experiments (DOEs), FMEAs, Statistical Process capability reports etc.
4. Maintain awareness of new, emerging packaging technologies to insure continual improvement of VisIC products.
5. Travel to subcontractors as necessary.

Typical Education & Experience

Minimum of Bachelor's Degree in Electronic, Mechanical, Industrialization Engineering or Material Science, in addition to at least 5 years’ experience in semiconductor packaging product development.

Required Skills

1. Deep understanding of semiconductor packaging technologies, materials and manufacturing methods. Knowledge of high power density discrete and modules is beneficial.

2. Demonstrable experience of driving complex projects from concept to high-volume manufacturing

through sub-contract supply chains.

3. Definition of process Design of Experiments, and use of statistical tools to quantify process capability.

4. Proficiency in 3D modeling software, such as SolidWorks, Fusion360 or similar.

5. Proficiency in 2D drawing generation including understanding of GD&T.

6.  Development and maintenance of design and process documentation systems to satisfy both

customer and regulatory standards, automotive would be of benefit. 

7. Ability to manage multiple projects simultaneously.

8.Proficiency in Thermal and Thermo-Mechanical FEA Simulation/Modelling would be beneficial.

9.Knowledge of semiconductor fabrication technology would be beneficial.

10.Knowledge of probe & test systems would be beneficial

11.Self starter, with excellent written and verbal communication skills.