Package Engineer

For an exciting well-funded start-up we are seeking a skilled ASIC Package Engineer to join our dynamic team. The ideal candidate will have expertise in designing, developing, and testing advanced packaging solutions for Application-Specific Integrated Circuits (ASICs). As an ASIC Package Engineer, you will collaborate closely with cross-functional teams including ASIC designers, system architects, and manufacturing engineers to deliver high-performance and cost-effective packaging solutions.

Requirements:

Responsibilities:

• Design and develop innovative packaging solutions for ASICs, considering factors such as electrical performance, thermal management, and reliability.
• Conduct feasibility studies and analysis to assess packaging options and advanced packaging technologies.
• Collaborate with ASIC designers to optimize package designs for signal integrity, power integrity.
• Work closely with manufacturing partners to ensure seamless integration of packaging processes into production workflows.
• Perform package simulations, modelling, and characterization to validate design performance and reliability under various operating conditions.
• Drive continuous improvement initiatives to enhance packaging design methodologies, tools, and best practices.
• Provide technical support to resolve packaging-related issues during product development and production ramp-up phases.
• Stay abreast of emerging packaging technologies, industry trends, and market developments to maintain competitive advantage.
  
  

• Bachelor's or master’s degree in electrical engineering, Mechanical Engineering, or related field.
• Proven experience in ASIC packaging design and development in semiconductor industry.
• Proficiency in CAD tools such as Ansys and Cadence toolset, or equivalent for package design and layout.
• Strong understanding of semiconductor packaging technologies, materials, and assembly processes.
• Familiarity with industry standards and specifications for ASIC packaging, including JEDEC, IPC, and SEMI.
• Excellent analytical and problem-solving skills with a keen attention to detail.
• Effective communication and collaboration skills to work in a fast-paced, cross-functional environment.
• Ability to manage multiple projects simultaneously and deliver results within tight deadlines.
• Experience with advanced packaging techniques such as 2.5D/3D integration, Flip Chip BGA (FCBGA), system-in-package (SiP), and fan-out wafer-level packaging (FOWLP).
• Knowledge of thermal management techniques and thermal simulation tools for package design optimization.
• Familiarity with reliability testing methodologies and standards for semiconductor devices.
  
  

• Hands-on experience with lab equipment for package characterization and failure analysis.
• Advanced degree (Ph.D.) in Electrical Engineering, Mechanical Engineering, or related field.