mechanical engineer

SderoTechnologies LTD (NexTenna) is a new disruptive start-up developing unique wireless communication systems for various applications, ranging from Cellular systems and products current and 5G, Wi-Fi access points and clients and all the way to high frequency systems such as SATCOM, Point to Point and Point to Multi-Point at the Micro-wave and millimeter wave range for Space and terrestrial systems.

As a Mechanical Design Engineer working for NexTenna you would join the Core development team that is now changing the world of wireless communication around the globe. You would lead the development of unique wireless products and system ranging from consumer handheld product and devices to large deployable wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes and you would need to provide innovative solutions from a mechanical design perspective, including Radom designs, design for mass-production, and design of mounting and integration.

Minimum of BSc. In Mechanical Engineering or equivalent with emphasis on electronic housing design, static and dynamic systems, consumer products and systems.

• Practical experience of positioners and mechanical alignment systems for Antennas and or electro-optical systems.

@Direct Mechanical design experience with Solid-works or equivalent.

Minimum of 5 years hands on experience supporting mechanical design for antennas, electronic packaging, mounting equipment, Radom’s, positioners for accurate pointing systems and conformal structures;

Direct Experience for sheet metal design, design for Die-cast and Injection Molding as well as 3D printers and unique printing technologies.

Hands-on experience assembling and integrating electronic systems, RF radios and Antenna systems into a mechanical packing for test set-ups and complete products.

Hands-on experience for stress analysis and thermal analysis for Radio systems.

Experience designing mechanical packaging and or Mechanical design of antennas into complete communication systems for either point to point and or point to multi-point.

In depth experience of thermal distribution and design for power dissipation.

Understanding of various manufacturing processes and technologies, such as die-cast, printed technologies, materials and integration, sheet metal design and manufacturing, stamping, semiconductor manufacturing process such as LCD’s, wafers etc.

Experience designing conformal Radom’s for low and high frequency products.

• Mass production experience and design experience in the semi-conductor industry is a plus.