Mobileye develops next-generation high-performance long-range LIDAR systems for autonomously driving vehicles. The project involves cutting-edge electro-optic modules for FMCW LIDAR, HW, VLSI, Mechanics, SW FW and Algorithms. We are looking for an experienced chip package designer engineer to be part of our LiDAR HW team

What will your job look like:

• Design chip package layout and HW boards layout
• Design and simulate high-performance signal-integrity multi-channel chip substrate, including layout, signal integrity and power integrity.
• Manage subcontracting and vendor for development and manufacturing of chip substrate, package and PCB
• Collaborate and support the VLSI, System Architecture team and peer teams from other projects
  
  

• Practical Engineering diploma. B.Sc in Electronic Engineering - an advantage
• 7+ years of hands-on experience as a chip package layout
• Experience with relevant CAD tooling for chip package layout
• Experience with managing leading chip packaging vendor
• Experience with layout of Digital High Speed, Analog and Power design. RF design experience - advantage
• Experience with Signal Integrity and Power Integrity simulation tools for Digital and analog using IBIS and S-Parameters models – an advantage
• Familiar with Automotive electronics regulations – an advantage.
• Hands-on lab experience – an advantage