Mechanical and Thermal Engineer – SoC to Rack Integration

We are seeking a Principal Mechanical and Thermal Engineer to lead the hardware definition of our next-generation AI infrastructure. This is a high-impact leadership role where you will serve as the primary technical authority for the physical architecture of advanced server platforms. You will bridge the critical gap between ultra-high-power silicon packaging, liquid-cooled node design, and massive-scale Rack deployments.

Key Responsibilities

Blade & Chassis Design: Lead the end-to-end mechanical definition of server blades, high-density chassis, and rack-level enclosures.
Structural Hardware: Architect the integration of sliding rails, blind-mate connectors, precision standoffs, and high-load Extraction Handles.
Power & Interconnects: Define mechanical paths for ultra-high-density power delivery (Busbars) and complex cable management.
Cold Plate Engineering: Direct the design of Liquid Cooling Cold Plates, optimizing internal micro-channels and manifold fluid distribution.
Fluid Management: Validate the selection and integration of Quick Disconnects (QDs) and leak-mitigation systems.
Simulation: Drive thermal strategy for 1kW+ nodes using CFD to balance hybrid air/liquid cooling.
HVM Mastery: Optimize designs for high-volume manufacturing using Precision Milling, Die Casting, and Complex Sheet Metal fabrication.
Environmental Ruggedization: Ensure system integrity against Transportation Shock & Vibration and extreme Thermal/Humidity cycling.
Total Lifecycle Design: Implement Design for Cost (DfC) and Easy Assembly (DFA) to ensure seamless serviceability and global deployment..

Requirements:

Required Qualifications

Education: B.S. or M.S. in Mechanical Engineering.
Experience: 12+ years in high-performance compute (HPC), AI hardware, or datacenter systems.
Architectural Pedigree: A proven track record of owning at least one full product lifecycle—from blank-page concept through High-Volume Manufacturing (HVM).
Liquid Cooling Expertise: Deep technical knowledge of fluid dynamics, wetted material compatibility, and the mechanical nuances of "Drip-Free" connector integration.
Manufacturing Mastery: Expert-level understanding of metal fabrication (Milling, Casting, Sheet Metal) and how these processes impact thermal performance and structural integrity.
Simulation Proficiency: Expert user of CFD and FEA tools for structural and vibration analysis.
Influence: Ability to drive technical alignment across silicon, power, and optical engineering teams.

Preferred Qualifications

Direct experience with AI/GPU-based architectures and ultra-high-density power delivery
Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
Experience with blind-mate liquid and power interfaces.