Senior IC Reliability Lead

We, NVIDIA Networking business unit, are looking for an IC reliability leader to lead the reliability activity of our cutting-edge, highly complex networking IC products. In this role, you will lead all reliability aspects of the world's greatest AI platforms, and most advanced networking solutions and take-part in the next technological revolution by driving quality and reliability processes. You will own the various IC reliability aspects: silicon reliability, package reliability, and ESD/LU characterization. We require a hardworking, driven, passionate engineer, who thrives in high-paced and dynamic environments, and closes tasks quickly within a short period of time.

What You'll Be Doing

• Lead qualification and reliability activity of NVIDIA NBU ICs- including qualification of additional substrate/assembly house vendors, leading CCB forums, and managing the reliability team and projects.
• Collaborating with design, layout, HW, package test, and characterization teams to understand the various IPs of the IC and define the required qualification plan.
• Own design-for-reliability (DFR) guidelines, and work with various design teams to promote (DFR) concepts in future design.
• Own cross-domain investigations of IC reliability issues to find root-cause and develop solutions.
• Work with characterization and PE teams to identify reliability risks based on production/characterization data and integrate them into the reliability plan.
• Collaborate with system-level quality and reliability teams to define end-to-end qualification plans.
  
  

• Degree in Electrical Engineering or Material Science.
• Experience of 5+ years in product level reliability
• Managerial and leadership skills to lead reliability team, CCB forums, and cross-organization processes
• Attention to detail, ability to work independently, ability to ask questions for clarification as needed, and tackle issues quickly and efficiently.
• We need applicants who can work on several projects in parallel, and drive fast, and accurate conclusions promptly.
• You will be required to have previous knowledge of package reliability, silicon reliability, and ESD/LU mechanisms.
• Applicants are required to have knowledge of flip-chip BGAs.
• Applicants should be capable of working independently and finding creative solutions.
• Excellent social skills and teamwork, making others commit to tasks and get results!
  
  

• Knowledge of IC tests and characterization methods.
• Familiarity with advanced transistor technologies, and manufacturing processes.
• Experience in data analytics, finding commonalities, and locating outliers.
• Working knowledge of design-for-reliability methods and implementation.