Embedded Systems Engineer, High Speed DSP

Required Embedded Systems Engineer, High Speed DSPAbout the jobIn this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.In this role, for High-Speed DSP, you will architect and define the low-level firmware and control loops powering our physical-layer communications silicon. Sitting at the critical intersection of digital signal processing (DSP), hardware-software co-design, and real-time systems, you will lead the development of adaptive algorithms, erדרישות:Minimum qualifications:Bachelors degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.10 years of industry experience in embedded systems/firmware, communication systems engineering, or digital signal processing (DSP) development.Experience developing embedded software (C/C++) for high-speed physical-layer interfaces (PHY), digital transceivers, or communication subsystems.Preferred qualifications:Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.Expertise in Forward Error Correction (FEC) algorithms and advanced modulation schemes.Track record defining firmware framework specifications, register maps, and Silicon Life-cycle Management telemetry for high-volume networking or AI silicon.Background in wireless communications with deep domain knowledge of channel modeling, noise mitigation, and digital transceiver architectures. המשרה מיועדת לנשים ולגברים כאחד.