Experienced Chip Package Design Engineer

Mobileye develops high-performance imaging radar for autonomously driving vehicles. The project involves cutting-edge HW, VLSI, mechanics, SW and Algorithms. We are looking for an Experienced Chip Package Design Engineer to be part of our imaging radar HW team.What will your job look like:Technical Project lead & Co Design to support the development of IC package with the OSAT, Si, VLSI and System Architecture teams.Manage subcontractors and vendors for development and manufacturing of chip substrate, IC package and IC testingDesign and hands-on one of the chip package layout, simulate high-performance signal/power-integrity chip substrate, including layout, mechanical & thermal simulationsCollaborate and support peer teams from other projectsAll you need is:B.Sc in Electronic or Mechanical Engineering3+ years of hands-on experience as managing chip packaging vendors5+ years of hands-on experiences in chip package activitiesExperience with relevant CAD tooling for chip package development & simulation for layout, mechanical & thermal simulationsExperience with Digital High Speed, Analog and Power designExperience with Signal Integrity and Power Integrity simulation tools for Digital and analog using IBIS and S-Parameters models – advantageFamiliar with Automotive industry– advantageExperience with RFIC design and simulation - advantageMobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!